Patents by Inventor David Bothman

David Bothman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220228811
    Abstract: Titanium-based thermal ground planes are described.
    Type: Application
    Filed: November 26, 2012
    Publication date: July 21, 2022
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Payam Bozorgi, Carl D. Meinhart, Marin Sigurdson, Noel C. MacDonald, David Bothman, Yu-Wei Liu
  • Patent number: 9992911
    Abstract: A thermal transfer system for reducing temperature cycling of an electronic device. The thermal system includes a thermally conductive device to which the electronic device is mounted, a heat sink and a thermal rail mounted to the heat sink. The thermal system further includes a plurality of shape memory alloy (SMA) elements extending through aligned openings in the rail and the thermally conductive device, where the SMA elements are shaped in a deformed wire-like configuration and attempt to return to an undeformed spring-like configuration when the plurality of SMA elements are heated above a transition temperature so as to increase a heat transfer contact pressure between the thermally conductive device and the rail.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: June 5, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Clint G. Buckman, Alex Chov, Matthew Kim, Hamahito Hokyo, Vinh Tran, David Bothman
  • Publication number: 20130327504
    Abstract: Titanium-based thermal ground planes are described.
    Type: Application
    Filed: November 26, 2012
    Publication date: December 12, 2013
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Payam Bozorgi, Carl D. Meinhart, Marin Sigurdson, Noel C. MacDonald, David Bothman, Yu-Wei Liu