Patents by Inventor David Boulin

David Boulin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe designs for plastic overmold packages
    Publication number: 20060237826
    Abstract: The specification describes a plastic overmolded package for high power devices that has a very low lead count, typically fewer than eight, and in a preferred embodiment, only two. The leads occupy essentially the same linear space as the multiple leads in a conventional package and thus have a wide-blade configuration. To improve mechanical integrity, the leads in the package are provided with retention slots to add back the equivalent of the plastic joints in the spaces that were eliminated due to the wide-blade design. The retention slots extend in the width dimension of the leads.
    Type: Application
    Filed: June 20, 2006
    Publication date: October 26, 2006
    Inventors: David Boulin, Hugo Safar
  • Leadframe designs for plastic overmold packages
    Publication number: 20060055063
    Abstract: The specification describes a plastic overmolded package for high power devices that has a very low lead count, typically fewer than eight, and in a preferred embodiment, only two. The leads occupy essentially the same linear space as the multiple leads in a conventional package and thus have a wide-blade configuration. To improve mechanical integrity, the leads in the package are provided with retention slots to add back the equivalent of the plastic joints in the spaces that were eliminated due to the wide-blade design. The retention slots extend in the width dimension of the leads.
    Type: Application
    Filed: September 13, 2004
    Publication date: March 16, 2006
    Inventors: David Boulin, Hugo Safar