Patents by Inventor David Boyd Rich
David Boyd Rich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7077007Abstract: A process for forming a microelectromechanical system (MEMS) device by a deep reactive ion etching (DRIE) process during which a substrate overlying a cavity is etched to form trenches that breach the cavity to delineate suspended structures. A first general feature of the process is to define suspended structures with a DRIE process, such that the dimensions desired for the suspended structures are obtained. A second general feature is the proper location of specialized features, such as stiction bumps, vulnerable to erosion caused by the DRIE process. Yet another general feature is to control the environment surrounding suspended structures delineated by DRIE in order to obtain their desired dimensions. A significant problem identified and solved by the invention is the propensity for the DRIE process to etch certain suspended features at different rates.Type: GrantFiled: November 18, 2003Date of Patent: July 18, 2006Assignee: Delphi Technologies, Inc.Inventors: David Boyd Rich, John C. Christenson
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Publication number: 20040099631Abstract: A process for forming a microelectromechanical system (MEMS) device by a deep reactive ion etching (DRIE) process during which a substrate overlying a cavity is etched to form trenches that breach the cavity to delineate suspended structures. A first general feature of the process is to define suspended structures with a DRIE process, such that the dimensions desired for the suspended structures are obtained. A second general feature is the proper location of specialized features, such as stiction bumps, vulnerable to erosion caused by the DRIE process. Yet another general feature is to control the environment surrounding suspended structures delineated by DRIE in order to obtain their desired dimensions. A significant problem identified and solved by the invention is the propensity for the DRIE process to etch certain suspended features at different rates.Type: ApplicationFiled: November 18, 2003Publication date: May 27, 2004Applicant: DELCO ELECTRONICS CORPORATIONInventors: David Boyd Rich, John C. Christenson
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Patent number: 6685844Abstract: A process for forming a microelectromechanical system (MEMS) device by a deep reactive ion etching (DRIE) process during which a substrate overlying a cavity is etched to form trenches that breach the cavity to delineate suspended structures. A first general feature of the process is to define suspended structures with a DRIE process, such that the dimensions desired for the suspended structures are obtained. A second general feature is the proper location of specialized features, such as stiction bumps, vulnerable to erosion caused by the DRIE process. Yet another general feature is to control the environment surrounding suspended structures delineated by DRIE in order to obtain their desired dimensions. A significant problem identified and solved by the invention is the propensity for the DRIE process to etch certain suspended features at different rates.Type: GrantFiled: February 14, 2001Date of Patent: February 3, 2004Assignee: Delphi Technologies, Inc.Inventors: David Boyd Rich, John C. Christenson
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Publication number: 20020125208Abstract: A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair.Type: ApplicationFiled: May 9, 2002Publication date: September 12, 2002Applicant: DELPHI TECHNOLOGIES, INC.Inventors: John Carl Christenson, Steven Edward Staller, John Emmett Freeman, Troy Allan Chase, Robert Lawrence Healton, David Boyd Rich
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Publication number: 20020109207Abstract: A process for forming a microelectromechanical system (MEMS) device by a deep reactive ion etching (DRIE) process during which a substrate overlying a cavity is etched to form trenches that breach the cavity to delineate suspended structures. A first general feature of the process is to define suspended structures with a DRIE process, such that the dimensions desired for the suspended structures are obtained. A second general feature is the proper location of specialized features, such as stiction bumps, vulnerable to erosion caused by the DRIE process. Yet another general feature is to control the environment surrounding suspended structures delineated by DRIE in order to obtain their desired dimensions. A significant problem identified and solved by the invention is the propensity for the DRIE process to etch certain suspended features at different rates.Type: ApplicationFiled: February 14, 2001Publication date: August 15, 2002Inventors: David Boyd Rich, John C. Christenson
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Patent number: 6428713Abstract: A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair.Type: GrantFiled: October 1, 1999Date of Patent: August 6, 2002Assignee: Delphi Technologies, Inc.Inventors: John Carl Christenson, Steven Edward Staller, John Emmett Freeman, Troy Allan Chase, Robert Lawrence Healton, David Boyd Rich
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Patent number: 6257062Abstract: An angular accelerometer having a substrate, a plurality of fixed electrodes supported on the substrate and each including fixed capacitive plates, and a rotational inertia mass including a plurality of movable capacitive plates arranged to provide a capacitive coupling with the fixed capacitive plates. The rotational inertia mass is rotationally movable relative to the fixed electrodes in response to angular acceleration. The angular accelerometer further includes support members for supporting the rotational inertia mass and biasing the rotational inertia mass relative to the fixed electrodes during rotational movement of the rotational inertia mass.Type: GrantFiled: October 1, 1999Date of Patent: July 10, 2001Assignee: Delphi Technologies, Inc.Inventor: David Boyd Rich
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Patent number: 5698785Abstract: A motion sensor for sensing motion or acceleration of a body, such as the type used in onboard automotive and aerospace safety control system, navigational system or active suspension control system. The motion sensor includes a support frame, a bridge projecting from the support frame, and a proof mass suspended from the support frame by the bridge so as to enable the proof mass to respond to an input force imposed on the motion sensor. The bridge is provided with a strain sensing element that generates an acceleration signal in response to a deflection of the proof mass. The motion sensor further includes a structural feature capable of compensating for mechanically and thermally induced strains imposed on the motion sensor by generating a compensation signal in response to such strains.Type: GrantFiled: August 7, 1996Date of Patent: December 16, 1997Assignee: Delco Electronics CorporationInventors: David Boyd Rich, William James Cleaver, Gregory Donald Swanson, Mark Billings Kearney