Abstract: An apparatus in one example has: a substrate having a microstrip line; a capacitor at a predetermined location along the microstrip line, the capacitor producing a discontinuity; and a ground plane assembly on the substrate, the ground plane assembly having an opening that compensates for the discontinuity of the capacitor.

Abstract: Systems are disclosed for providing a DC-bias network for a RF distributed amplifier. One embodiment may include a DC-bias network comprising a planar substrate having an input port configured to receive a DC input signal and provide a DC bias at an output port, a microstrip line mounted to the planar substrate and interconnecting the input port and the output port, and a plurality of RF resonators coupled to the microstrip line. Each of the plurality of RF resonators are configured to provide a substantially constant impedance for a respective portion of the frequency band of the RF signal.

Abstract: Systems are disclosed for providing a DC-bias network for a RF distributed amplifier. One embodiment may include a DC-bias network comprising a planar substrate having an input port configured to receive a DC input signal and provide a DC bias at an output port, a microstrip line mounted to the planar substrate and interconnecting the input port and the output port, and a plurality of RF resonators coupled to the microstrip line.

Abstract: An apparatus in one example has: a substrate having a microstrip line; a capacitor at a predetermined location along the microstrip line, the capacitor producing a discontinuity; and a ground plane assembly on the substrate, the ground plane assembly having an opening that compensates for the discontinuity of the capacitor.

Abstract: A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is positioned in a gap in the substrate, on which are formed conventional microwave transmission lines for purposes of MMIC interconnection. On each side of the gap, the substrate is tapered in thickness between the normal substrate thickness and the much smaller thickness of the MMIC. The transmission lines in this transition region are tapered in width as the substrate is tapered in thickness, thereby maintaining uniform transmission line characteristics, particularly the characteristic impedance of the transmission line. Small connector ribbons provide electrical connection between the tapered transmission lines and the MMIC. A method is also disclosed for fabricating multiple substrate sections for use in the structure of the invention.

Abstract: A low loss suspended substrate coupler includes a substrate having a first transmission line disposed on a topside of the substrate and a second transmission line disposed on the bottom side of the substrate, thereby providing broadside transmission line coupling. To provide closer mode velocity matching, the coupler has capacitive loading or coupling to ground at discrete intervals between the two transmission lines. The capacitive loading is formed by integrating stubs in each transmission line at pre-determined intervals, each of which is opposite a corresponding one of a plurality of ground stubs on the other side of the substrate. The ground stubs are connected to ground at the outer edge of the coupler area with substrate vias or directly to the coupler housing.