Abstract: Apparatus for the thermal treatment of a component, which can be arranged in a component plane (E) in the apparatus, which component plane is spanned by a first direction (x) and a second direction (y) perpendicular to the first direction, the apparatus comprising a heating portion having a heating means for heating a first region of the component, a cooling portion having a cooling means for cooling a second region of the component; wherein the cooling portion is downstream of the heating portion in the second direction (y); wherein the cooling means has a nozzle for discharging a cooling fluid onto the component; wherein the nozzle is oriented such that it drops in the second direction (y); and wherein the nozzle has a fluid channel having a nozzle opening. By means such apparatus, components can be thermally treated individually in different regions.

Abstract: A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein the reactive layer is positioned such that detection of tampering causes the reactive layer to be electrically or thermally energized such that the semiconductor device is at least partially destroyed.