Patents by Inventor David Byron Borlaug

David Byron Borlaug has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HMN unit cell class
    Patent number: 11399427
    Abstract: In one embodiment, a system includes a ground layer, a first layer, a second layer, and a plurality of vias. The first layer includes a first insulating material and a plurality of first metallic strips. The second layer includes a second insulating material and a plurality of second metallic strips. The plurality of vias electrically connect one or more of the plurality of first metallic strips of the first layer to one or more of the plurality of second metallic strips of the second layer. The plurality of first metallic strips of the first layer and the plurality of second metallic strips of the second layer form a plurality of capacitors and a plurality of conductors. Each capacitor is located in the first layer. Each conductor is partially located in the first layer and partially located in the second layer.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: July 26, 2022
    Assignee: Lockheed Martin Corporation
    Inventor: David Byron Borlaug
  • HMN UNIT CELL CLASS
    Publication number: 20210105892
    Abstract: In one embodiment, a system includes a ground layer, a first layer, a second layer, and a plurality of vias. The first layer includes a first insulating material and a plurality of first metallic strips. The second layer includes a second insulating material and a plurality of second metallic strips. The plurality of vias electrically connect one or more of the plurality of first metallic strips of the first layer to one or more of the plurality of second metallic strips of the second layer. The plurality of first metallic strips of the first layer and the plurality of second metallic strips of the second layer form a plurality of capacitors and a plurality of conductors. Each capacitor is located in the first layer. Each conductor is partially located in the first layer and partially located in the second layer.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 8, 2021
    Inventor: David Byron Borlaug