Patents by Inventor David Byrum Hicks

David Byrum Hicks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6054659
    Abstract: Structures and fabrication methods of micromachined all-metal relays on silicon chips are described. The relay comprises a copper blade, electroformed into the lithographically patterned areas, with suitable dimensions of 1 mm.times.2 mm.times.0.01 mm (width.times.length.times.thickness) and a plurality of longitudinal slots to facilitate fabrication of the blade. The relay is actuated by electrostatic force, and no conduction current is required to hold the relay at either "on" or "off" state. Preferably, the relay is used in combination with a suitable arc suppression circuit.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: April 25, 2000
    Assignee: General Motors Corporation
    Inventors: Han-Sheng Lee, Chi Hung Leung, Qian Shi, Shih-Chia Chang, David Byrum Hicks, Samuel Lorincz, Iulian Nedelescu