Abstract: The present invention relates to a socket for testing ICs and, in particular, high speed ICs in BGA packages, and a means of holding an IC package in the test socket. The socket uses resilient conductive test pads positioned on a substrate in an array to match an array of spherical contacts on the bottom of a BGA package. The BGA package is aligned with the test pads by the use of holes centered on the test pads into which the spherical contacts are seated. The test socket is provided with two flexible seals on the top of a support, which encircle the test pads. The flexible seals, together with a top surface of a support and a socket lid, define an enclosed cavity to which a vacuum is applied. The flexible seals are thereby compressed pulling the socket lid inward and forcing the IC package leads into contact with the test pads.

Abstract: The present invention relates to a socket for testing ICs and, in particular, high speed ICs in BGA packages. The socket uses resilient conductive test pads positioned on a substrate in an array to match an array of spherical contacts of the bottom of a BGA package. The BGA package is aligned with the test pads by the use of holes centered on the test pads into which the spherical contacts are seated. The holes may also be used to interconnect conductive signal paths on layers of the substrate.