Abstract: A template for aligning a rework tool head and a substrate (such as a printed circuit board) for the accurate placement of a ball grid array package on the substrate with the head, prior to soldering the package to the substrate. The template has a top formed to attach the template to the head in a reproducible position and an indicator rigidly connected to the top to align the template to a feature on the substrate. In one embodiment, the template has a top side formed to mimic the top of the ball grid array package and a bottom side rigidly connected to the top side and formed to show the placement of the balls on the bottom of the ball grid array package in reference to the top of the ball grid array package.

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract: A self contained desoldering gun (10) with a built in vacuum pump (40). Vacuum pump (40) is operated by a low voltage DC electric motor (50) which is connected electrically in series with heating tip (20). Heating tip (20) reduces the voltage in the circuit and reduces the size of the motor required to operate pump (40). A second heating element may be used when motor (50) is energized.

Abstract: A rework station for soldering/desoldering of integrated circuits on a printed circuit board (PCB) wherein a gantry mounted on a base positions hot gas delivery and vacuum application apparatus over a PCB carried between carrier arms mounted on a horizontal arm slidably mounted in a pinion block for movement in the X direction with respect to the base. The pinion block is slidably mounted in the base for movement in the Y direction. A combination of sprockets and idlers transmits X and Y drives for driving the horizontal arm and pinion block from control dials mounted at the front edge of the base.