Patents by Inventor David C. Leber

David C. Leber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4891586
    Abstract: An electrical test probe has a electrically conductive hollow elongate body with an exterior coating of electrically insulative material. An output connector is formed by soldering an electrically conductive wire to the exterior of the elongate body. A hooked gripping tip for probing Integrated circuit devices and the like is formed on one end of a conductive shaft inserted into the elongate body. Axial movement of the conductive shaft relative to the elongate body alternately extends and retracts the hooked gripping tip out of and into the elongate body. The electrically conductive elongate body provides a low contact resistance path between the gripping tip and the output connector.
    Type: Grant
    Filed: February 13, 1989
    Date of Patent: January 2, 1990
    Assignee: Tektronix, Inc.
    Inventors: David C. Leber, William B. Tuff, Paul L. Verstrate
  • Patent number: 4694572
    Abstract: A method of manufacturing printed circuit boards includes injection molding a polymer component which may include a substrate for a printed circuit, forming circuit runs and circuit pads on the substrate with conductive adhesive, placing circuit components onto the circuit pads and curing the conductive adhesive. The adhesive may be silkscreened onto the polymer substrate. This process obviates the need for the large number of expensive manufacturing steps necessary to produce conventional etched fiberglass printed circuit boards.
    Type: Grant
    Filed: June 13, 1986
    Date of Patent: September 22, 1987
    Assignee: Tektronix, Inc.
    Inventors: David C. Leber, Timothy L. Falk