Abstract: An inspection system (20) has an image capture device (10) that is mounted onto a wafer prober (15) for the electrical verification of electronic components (60) having an emissive display (61). The image capture device (10) includes a lens (31) that collects the image generated by the emissive display (61). The image is passed to mirrors (36,37) which redirect a portion of the image into a pickup device (41). The emissive display (61) is partitioned into subregions (62-65) to facilitate the capturing of the image. As the image of each of the subregions (62-65) is collected by image capture device (10), the other subregions (62-65) are deactivated.

Abstract: An optical housing (30) includes an optical pedestal (10), a light-blocking mask (31), and a translucent light diffuser (32). The optical housing (30) is used to inspect a work piece (51) placed on a top surface (21) of the optical pedestal (10). Diffusive light is transmitted from the translucent light diffuser (32) into the optical pedestal (10) via a portion of an optically polished bottom surface (11) that is uncovered by the light-blocking mask (31). In the optical pedestal (10), light is reflected by an optically polished inclined surface (23) and refracted by another optically polished inclined surface (25). When light is transmitted away from the optical pedestal (10) after being refracted, it is a collinear light beam and substantially parallel to the top surface (21) of the optical pedestal (10).

Abstract: Two partial cylindrical, externally pressurized static air bearings are used to provide a self aligning air bearing platform. The self aligning air bearing platform is useful in a tape automated bonding system to bond a semiconductor device having a high pin count. A bottom bearing block has a top surface in the shape of an arc and at least one air outlet. A middle bearing block has a bottom surface configured to mate with the top surface of the bottom bearing block. The middle bearing block also has a top surface in a shape of an arc which is rotated 90.degree. with respect to the arc shaped top surface of the bottom bearing block and at least one air outlet. A top bearing block mates with the middle bearing block and provides the platform for holding the semiconductor device. Air bearings between the moving bearing blocks provide a low friction bearing for the aligning platform.