Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.

Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.

Abstract: An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.

Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: A snap-fit shield is provided which fits securely within a frame opening, and which shields and grounds the opening while eliminating a need for a complementary connector portion. The shield has an insulative inner housing having a first base wall and a first pair of side walls and end walls extending therefrom defining a first cavity. The shield includes a conductive shell having a second base wall and a second pair of side walls and end walls extending therefrom defining a second cavity. The second pair of side walls and end walls have at least one outward bias positioned thereon. The shield also has an insulative outer housing having a third base wall and a third pair of side walls and end walls extending therefrom defining a third cavity. The outer housing is configured to snap-fit within an opening in a frame so as to shield circuitry internal thereto.

Abstract: A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.

Abstract: A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.

Abstract: A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level.

Abstract: A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level.

Abstract: A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

Abstract: A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

Abstract: A cost efficient, highly reliable method to remove electronic devices and components from substrates eliminates separate tooling for every substrate and device or component size. The apparatus which implements the method allows for multiple device or component removal simultaneously, or in a single sequential operation, in a nondestructive action in a very low cost environment. A box oven and vacuum system and is used with different device or component and substrate sizes providing a simple, low cost, molten device removal procedure, eliminating the need for thermal monitor build and associated profiling for each product. The apparatus works independently of chip type or size, utilizing universal fixturing, and can be set up to pull multiple devices and/or components in a single run.

Abstract: Deformation of a lifting ring of bimetallic structure or memory metal is matched to a solder softening or melting temperature to apply forces to lift a chip from a supporting structure, such as a substrate or multi-chip module, only when the solder connections between the chip and the supporting structure are softened or melted. The temperature of the chip, module and solder connections there between is achieved in a commercially available box oven or belt furnace or the like and results in much reduced internal chip temperatures and thermal gradients within the chip as compared to known hot chip removal processes. Tensile and/or shear forces at solder connections and chip and substrate contacts are much reduced in comparison with known cold chip removal processes. Accordingly, the process is repeatable at will without significant damage to or alteration of electrical characteristics of the chip or substrate.

Abstract: A heat exchanger includes a housing, a reservoir comprising a solid material mounted within the housing, temperature control means for controlling the temperature of the reservoir, and energy exchange means for allowing thermal contact between the reservoir and a substance for effectuating transfer of energy from the reservoir to the substance for regulating the temperature of the substance.

Abstract: A transfer device especially suitable for transferring a minute electronic component part from a first location and position to a second location and position, the component part having critical facet sides of high integrity and at least one non-critical side, is disclosed. The transfer device comprises a non-destructive engaging means, a control means, and a decoupling means, whereby the integrity of the essential facet sides of the component part is maintained.

Abstract: An apparatus for producing aerosol from a substance includes a heat exchanger for receiving and cooling a substance. The heat exchanger includes a housing; a cryogenic reservoir comprising a solid material mounted within the housing; temperature control means for controllably cooling the reservoir; and energy exchange means for allowing thermal contact between the reservoir and the substance for effectuating transfer of cooling energy from the cryogenic reservoir to the substance for controllably cooling the substance. A delivery line has an inlet for receiving the substance from the heat exchanger at a first pressure. A nozzle is connected to the delivery line for receiving the substance from the delivery line. The nozzle has at least one exit opening which allows passing of the substance therethrough for expanding the substance from the first pressure to a second pressure which is lower than the first pressure for solidifying the substance and producing aerosol.