Patents by Inventor David C. Olson

David C. Olson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for improved module assembly using shape memory alloy springs
    Patent number: 6436223
    Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: August 20, 2002
    Assignee: International Business Machines Corporation
    Inventors: David L. Edwards, Enrique C. Abreu, Ronald L. Hering, David C. Olson
  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5636781
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: June 10, 1997
    Assignee: International Business Machines Corporation
    Inventors: David C. Olson, Robert Phillips, III
  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5556024
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: September 17, 1996
    Assignee: International Business Machines Corporation
    Inventors: David C. Olson, Robert Phillips, III