Abstract: A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a second member. The first member and the second member may be separated by a repitch angle. The second member may be repositioned such that the first member and the second member are separated by a product angle. The first member may receive a leading portion and second member may receive a trailing portion of the substrate assembly and each member may rotate at the first velocity. The leading portion and the trailing portion are separated by a product arc length, which may be equal to a process product pitch. The substrate assembly may then undergo one or more processes such as bonding, cutting, and/or scoring.

Abstract: A method for mechanically deforming, such as by bonding, a substrate assembly. The substrate assembly may be advanced at first velocity toward a bonder apparatus. The bonder apparatus may rotate at a second velocity, which is less than or equal to the first velocity. The bonder apparatus may include a support surface and a process assembly. The substrate assembly may be contracted prior to advancing onto the bonder apparatus. A first process assembly may receive a leading portion of the substrate assembly and a subsequent process assembly may receive a trailing portion. The leading portion and the trailing portion define a product arc length, which is less than or equal to a process product pitch. One or more processes may be performed on the substrate assembly.

Abstract: A method for mechanically deforming a substrate assembly. The substrate assembly may advance at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between a first member and a second member. The first and second members may rotate at the first velocity and may be separated by an initial angle. The first member may receive a leading portion and the second member may receive a trailing portion of the substrate assembly. The first member may decelerate to a second velocity, and, subsequently, the second member may decelerate to the second velocity. The first member and the second member may be separated by a process angle, which may be different than the initial angle. A central portion of the substrate assembly may be relaxed while the leading and trailing portion may be held at a process tension. The substrate assembly may then undergo one or more processes.

Abstract: A method for mechanically deforming a substrate assembly. The substrate assembly may advance at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between a first member and a second member. The first and second members may rotate at the first velocity and may be separated by an initial angle. The first member may receive a leading portion and the second member may receive a trailing portion of the substrate assembly. The first member may decelerate to a second velocity, and, subsequently, the second member may decelerate to the second velocity. The first member and the second member may be separated by a process angle, which may be different than the initial angle. A central portion of the substrate assembly may be relaxed while the leading and trailing portion may be held at a process tension. The substrate assembly may then undergo one or more processes.

Abstract: A method for mechanically deforming, such as by bonding, a substrate assembly. The substrate assembly may be advanced at first velocity toward a bonder apparatus. The bonder apparatus may rotate at a second velocity, which is less than or equal to the first velocity. The bonder apparatus may include a support surface and a process assembly. The substrate assembly may be contracted prior to advancing onto the bonder apparatus. A first process assembly may receive a leading portion of the substrate assembly and a subsequent process assembly may receive a trailing portion. The leading portion and the trailing portion define a product arc length, which is less than or equal to a process product pitch. One or more processes may be performed on the substrate assembly.

Abstract: A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a second member. The first member and the second member may be separated by a repitch angle. The second member may be repositioned such that the first member and the second member are separated by a product angle. The first member may receive a leading portion and second member may receive a trailing portion of the substrate assembly and each member may rotate at the first velocity. The leading portion and the trailing portion are separated by a product arc length, which may be equal to a process product pitch. The substrate assembly may then undergo one or more processes such as bonding, cutting, and/or scoring.