Patents by Inventor David C. Schalcosky

David C. Schalcosky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for bonding semiconductor elements
    Patent number: 11295996
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: April 5, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: James E. Eder, David C. Schalcosky
  • SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    Publication number: 20200273759
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of
    Type: Application
    Filed: May 12, 2020
    Publication date: August 27, 2020
    Inventors: James E. Eder, David C. Schalcosky
  • Systems and methods for bonding semiconductor elements
    Patent number: 10692783
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: June 23, 2020
    Assignee: KULICKE AND SOFFA, INDUSTRIES, INC.
    Inventors: James E. Eder, David C. Schalcosky
  • SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    Publication number: 20180090395
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of
    Type: Application
    Filed: December 4, 2017
    Publication date: March 29, 2018
    Inventors: James E. Eder, David C. Schalcosky
  • SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    Publication number: 20150155211
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of
    Type: Application
    Filed: November 25, 2014
    Publication date: June 4, 2015
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: James E. Eder, David C. Schalcosky