Abstract: A semiconductor probe and alignment system are disclosed. The semiconductor probe includes a silicon-based substrate and membrane on which a plurality of pyramid shaped contactors are formed. Each of the contactors includes a metalized tip for contacting bonding pads on a semiconductor die. The area of the probe surrounding each contactor is thinned to form a membrane to provide flexibility and thus compliance to assure contact between each contactor and its respective bonding pad. In the alignment system, a guide wall formed from a photo-imageable material is created around at least a portion of each bonding pad to provide alignment for guiding the contactors on the probe onto the bonding pads.

Abstract: A process for nondestructive testing of beam lead bonds in disclosed. A high pressure liquid jet is applied to the beam leads adjacent the bond pad such that a force is applied to the lead in the opposite direction of the bonding step. If the bond does not have sufficient strength, the lead is bent away from the bonding pad and can be detected either visually or electrically. If the bond does have sufficient strength to withstand the force, no degradation of the bond occurs.