Abstract: Apparatus and methods for compensating for the movement of a substrate in a lithographic apparatus during a pulse of radiation include providing a pivotable mirror configured to move a patterned radiation beam incident on the substrate in substantial synchronism with the substrate.

Abstract: Apparatus and methods for compensating for the movement of a substrate in a lithographic apparatus during a pulse of radiation include providing a pivotable mirror configured to move a patterned radiation beam incident on the substrate in substantial synchronism with the substrate.

Abstract: Blades pivotally attached together linked to push rods and inserted into an illumination field, energy or flux. The blades extend longitudinally along the length of a rectangular illumination field or slit used to image a reticle onto a photosensitive substrate. The blades controllably adjust the width of the rectangular illumination field to modify the illumination intensity or energy provided to a photosensitive substrate. The illumination field is scanned across the photosensitive substrate to expose it with the image of a reticle. The blades are dynamically controlled during the scanning exposure to adjust the illumination intensity or energy in a predetermined way. The resulting selective change in exposure dose corrects local area of line width variance. Various errors in pattern reproduction using a photolithographic system are relatively easily corrected. This is particularly advantageous in a scanning lithography system used in the manufacture of semiconductors.

Abstract: Blades pivotally attached together linked to push rods and inserted into an illumination field, energy or flux. The blades extend longitudinally along the length of a rectangular illumination field or slit used to image a reticle onto a photosensitive substrate. The blades controllably adjust the width of the rectangular illumination field to modify the illumination intensity or energy provided to a photosensitive substrate. The illumination field is scanned across the photosensitive substrate to expose it with the image of a reticle. The blades are dynamically controlled during the scanning exposure to adjust the illumination intensity or energy in a predetermined way. The resulting selective change in exposure dose corrects local area of line width variance. Various errors in pattern reproduction using a photolithographic system are relatively easily corrected. This is particularly advantageous in a scanning lithography system used in the manufacture of semiconductors.