Abstract: A cutting machine for cutting a vegetable product includes a multi-knife cutting plate mounted in-line along a product flow path and a drive motor, whereby the cutting plate moves in an orbital motion in a plane substantially perpendicular to the flow path, thereby moving the cutting knives sequentially and repeatedly across the product flow path. A system for cutting vegetable products includes a transport system configured for transporting vegetable products in single file toward an outlet, a plurality of cutting machines, a collection system disposed downstream of the cutting machines and configured to collect the vegetables after cutting, and a selection device configured to selectively couple the outlet of the transport system to one or more of the cutting machines. The plurality of cutting machines may be mounted upon a transport device to selectively move one of the cutting machines into communication with the outlet of the transport system.

Abstract: A cutting machine for cutting a vegetable product includes a frame, supporting a product flow path, at least three links, pivotally attached to the frame, a cutting plate, pivotally attached to each of the three links at three pivot points and oriented substantially perpendicular to the flow path, a plurality of cutting knives, carried by the cutting plate, each having a generally corrugated configuration defining adjacent peaks and troughs, the cutting knives oriented angularly with respect to each other, and a drive motor, coupled to rotationally drive at least one of the links with respect to the frame, whereby the cutting plate moves in an orbital motion in a plane substantially perpendicular to the flow path, thereby moving the cutting knives sequentially and repeatedly across the product flow path.

Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.

Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.

Abstract: A method for drying a wet semiconductor substrate includes immersing the wet substrate in a rinsing liquid in a sealed drying chamber, producing a volume of vaporized drying fluid in a vapor generator, establishing fluid communication between the vapor generator and the drying chamber, transferring the vaporized drying fluid to the drying chamber by removing the rinsing liquid from the drying chamber, and allowing the vaporized drying fluid to condense on the wet substrate. The method further includes providing vacuum pressure within the drying chamber and backfilling the drying chamber with an inert gas to substantially achieve atmospheric pressure.

Abstract: Selected scene regions are imaged. IMAGING CHANNEL: mirrors (preferably MEMS) address an imaging sensor to regions. CALIBRATION CHANNEL: the mirrors direct radiation from a source to a calibration sensor, along an imaging-channel segment. Beam splitter(s) let the channels share optical path at the mirrors. To minimize imaging-channel diffractive blur, the calibration channel modifies wavefront angle and smoothness at the mirrors—measuring (and setting mirrors to optimize) PSF sharpness, then applying these measurements (and settings) to optimize imaging-channel settings by iterative multidimensional gradient search. An afocal lens receives scene radiation, magnifying deflection at the scene. An FOR is imaged on the imaging sensor; the mirrors address the sensor to a narrow FOV within the FOR; the lens enlarges deflections to cover the FOR. Plural diffraction-grating orders communicate between calibration source and sensor when the selected region is in plural scene portions, regardless which FOV is addressed.

Abstract: Selected scene regions are imaged. IMAGING CHANNEL: mirrors (preferably MEMS) address an imaging sensor to regions. CALIBRATION CHANNEL: the mirrors direct radiation from a source to a calibration sensor, along an imaging-channel segment. Beam splitter(s) let the channels share optical path at the mirrors. To minimize imaging-channel diffractive blur, the calibration channel modifies wavefront angle and smoothness at the mirrors—measuring (and setting mirrors to optimize) PSF sharpness, then applying these measurements (and settings) to optimize imaging-channel settings by iterative multidimensional gradient search. An afocal lens receives scene radiation, magnifying deflection at the scene. An FOR is imaged on the imaging sensor; the mirrors address the sensor to a narrow FOV within the FOR; the lens enlarges deflections to cover the FOR. Plural diffraction-grating orders communicate between calibration source and sensor when the selected region is in plural scene portions, regardless which FOV is addressed.

Abstract: A method for drying a wet semiconductor substrate includes the steps of immersing the substrate in a drying liquid in a drying chamber; removing the substrate from the drying liquid within the drying chamber; purging the drying chamber with inert gas; exposing the substrate to vacuum pressure within the drying chamber; and backfilling the drying chamber with the inert gas to substantially achieve atmospheric pressure. A system for drying a semiconductor substrate includes a drying chamber, a drying liquid reservoir in fluid communication with the drying chamber, a liquid pump, an inert gas supply in fluid communication with the drying chamber, and a vacuum pressure source in fluid communication with the drying chamber.

Abstract: Selected scene regions are imaged. IMAGING CHANNEL: mirrors (preferably MEMS) address an imaging sensor to regions. CALIBRATION CHANNEL: the mirrors direct radiation from a source to a calibration sensor, along an imaging-channel segment. Beam splitter(s) let the channels share optical path at the mirrors. To minimize imaging-channel diffractive blur, the calibration channel modifies wavefront angle and smoothness at the mirrors—measuring (and setting mirrors to optimize) PSF sharpness, then applying these measurements (and settings) to optimize imaging-channel settings by iterative multidimensional gradient search. An afocal lens receives scene radiation, magnifying deflection at the scene. An FOR is imaged on the imaging sensor; the mirrors address the sensor to a narrow FOV within the FOR; the lens enlarges deflections to cover the FOR. Plural diffraction-grating orders communicate between calibration source and sensor when the selected region is in plural scene portions, regardless which FOV is addressed.