Patents by Inventor David Chai

David Chai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240095252
    Abstract: Methods and systems are provided for ranking search results and generating a presentation. In some implementations, a search system generates a presentation based on a search query. In some implementations, a search system ranks search results based on data stored in a knowledge graph. In some implementations, a search system identifies a modifying concept such as a superlative in a received search query, and determines ranking properties based on the modifying concept.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Chen Zhou, Chen Ding, David Francois Huynh, JinYu Lou, Yanlai Huang, Hongda Shen, Guanghua Li, Yiming Li, Yangyang Chai
  • Publication number: 20240078274
    Abstract: A technique for providing search results may include determining a first entity type, a second entity type, and a relationship type based on a compositional query. The technique may also include identifying nodes of a knowledge graph corresponding to entity references of the first entity type and entity references of the second entity type. The technique may also include determining from the knowledge graph an attribute value corresponding to the relationship type for each entity reference of the first entity type and for each entity reference of the second entity type. The technique may also include comparing the attribute value of each entity reference of the first entity type with the attribute value of each entity reference of the second entity type. The technique may also include determining one or more resultant entity references from the entity references of the first entity type based on the comparing.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 7, 2024
    Inventors: Jinyu Lou, Ying Chai, Chen Ding, Lijie Chen, Liang Hu, Kejia Liu, Weibin Pan, Yanlai Huang, David Francois Huynh
  • Patent number: 9957956
    Abstract: The present invention covers systems and methods for priming a canister fluid filtration system. It utilizes the push and pull caused by the movement of a piston of a priming pump between two openings in the chamber of the priming pump, to push the air out of the canister and introduces fluid into it, thereby achieving the purpose of priming the fluid filtration system.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 1, 2018
    Inventor: David Chai
  • Publication number: 20170322594
    Abstract: A case, for an electronic device such as a mobile phone, containing an insert located near a camera, still image recorder, or video recorder and a flash of the device is disclosed. The placement, material, color, and properties of the insert helps reduce and/or eliminate problems associated with the case affecting the resultant flash/light from the camera causing and adding erroneous colors, effects, and information on the resulting pictures, images, sensors, or videos.
    Type: Application
    Filed: July 24, 2017
    Publication date: November 9, 2017
    Applicant: Samsonite IP Holdings S.àr.I.
    Inventors: Ryan Hill Mongan, Bryan Lee Hynecek, Jarret Lee Weis, David Chai-wen Lean
  • Publication number: 20080233684
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Application
    Filed: April 23, 2008
    Publication date: September 25, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Patent number: 7425470
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: September 16, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Publication number: 20070045797
    Abstract: Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.
    Type: Application
    Filed: September 1, 2005
    Publication date: March 1, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Teck Lee, David Chai, Hong Ng
  • Publication number: 20060173389
    Abstract: The REFLEX MASSAGER is a plastic hand-held, non-electric, massager for the human body. The massager consists of a handle with massaging balls attached by flexible spring coils to the ends of the handle/base unit. The massaging balls of the massager comes in contact with the skin and are rolled all over the body to provide a deep, powerful massage.
    Type: Application
    Filed: February 3, 2005
    Publication date: August 3, 2006
    Inventor: David Chai
  • Patent number: 7057281
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: June 6, 2006
    Assignee: Micron Technology Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Publication number: 20060011845
    Abstract: A method for enhancing the light yield of a doped scintillation crystal may include a reducing step if the crystal includes a dopant, such as cerium in a first oxidation state, such as the 4+ state. The scintillation crystal may include a rare earth silicate. The reducing may include heating in an oxygen-free ambient. The reducing may be used after an oxygen vacancy filling step that causes at least some of the dopant to increase in its oxidation state.
    Type: Application
    Filed: September 19, 2005
    Publication date: January 19, 2006
    Applicant: Crystal Photonics, Incorporated
    Inventors: Bruce Chai, David Chai, Randall Lux
  • Publication number: 20050080612
    Abstract: The present invention relates to a spelling and encoding method for ideographic symbols, such as Chinese characters. The spelling method can provide first and second components for identifying first and second groups of ideographic symbols, wherein the two groups can have at least one common ideographic symbol correlating with the two components. For example, the two components can be a Chinese Pinyin spelling and a Four Corner Numerical Index, respectively, which can each identify a group of Chinese characters and be combined to identify one or more characters. The spelling method can further provide a third component to differentiate a plurality of ideographic symbols common to the two groups to uniquely identify each common symbol. In one embodiment, an alphanumeric spelling can be provided to uniquely identify each ideographic symbol. The encoding method can encode various alphanumeric representations of the ideographic symbols by the 7-bit ASCII standard code.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 14, 2005
    Inventors: David Chai, Sing Lin, Andrew Soong
  • Publication number: 20040173899
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Application
    Filed: April 28, 2003
    Publication date: September 9, 2004
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing