Abstract: An ultrasonic imaging system wherein an exemplary system includes an array of transducer elements arranged along a first plane for transmitting first signals and receiving reflected signals for image processing. Circuit structures each have a major surface positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures in a stack-like formation. Electrical connections are formed between adjacent circuit structures in the sequence. A connector region on each circuit structure includes a distal portion extending away from the major surface-with distal portions of connector regions of adjacent structures spaced apart from one another. A first wiring pattern extends from the major surface to the distal portion of the connector region.

Abstract: An ultrasonic imaging system (200). An exemplary system includes an array of transducer elements (50) arranged along a first plane (P1) for transmitting first signals and receiving reflected signals for image processing. Circuit structures (10, 20, 30, 40) each have a major surface (1a) positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures (10, 20, 30, 40) in a stack-like formation. Electrical connections (34, 47) are formed between adjacent circuit structures in the sequence. A connector region (1b or 1b?) on each circuit structure includes a distal portion (1c or 1c?) extending away from the major surface (1a), with distal portions (1c, 1c?) of connector regions of adjacent structures spaced apart from one another. A first wiring pattern (41, 45, 46) extends from the major surface to the distal portion of the connector region.

Abstract: A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.

Abstract: A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.

Abstract: A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.