Abstract: Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

Abstract: Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

Abstract: Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.

Abstract: Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.

Abstract: Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: An ultrasonic imaging system wherein an exemplary system includes an array of transducer elements arranged along a first plane for transmitting first signals and receiving reflected signals for image processing. Circuit structures each have a major surface positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures in a stack-like formation. Electrical connections are formed between adjacent circuit structures in the sequence. A connector region on each circuit structure includes a distal portion extending away from the major surface-with distal portions of connector regions of adjacent structures spaced apart from one another. A first wiring pattern extends from the major surface to the distal portion of the connector region.

Abstract: An ultrasonic imaging system (200). An exemplary system includes an array of transducer elements (50) arranged along a first plane (P1) for transmitting first signals and receiving reflected signals for image processing. Circuit structures (10, 20, 30, 40) each have a major surface (1a) positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures (10, 20, 30, 40) in a stack-like formation. Electrical connections (34, 47) are formed between adjacent circuit structures in the sequence. A connector region (1b or 1b?) on each circuit structure includes a distal portion (1c or 1c?) extending away from the major surface (1a), with distal portions (1c, 1c?) of connector regions of adjacent structures spaced apart from one another. A first wiring pattern (41, 45, 46) extends from the major surface to the distal portion of the connector region.

Abstract: A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.

Abstract: A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.

Abstract: A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.