Abstract: A thermal conductive apparatus includes a first electrode sheet, a second electrode sheet, a cooling sheet, and a polymer dielectric layer. The polymer dielectric layer physically contacts the first electrode sheet and the second electrode sheet via the top surface thereof, and the cooling sheet via the bottom surface thereof, and exhibits a coefficient of thermal conductivity above 1.0 W/mK. The interfaces between the first electrode sheet, the second electrode sheet, the cooling sheet, and the polymer dielectric layer include at least one micro-rough surface. The micro-rough surfaces include plural nodules thereon formed by electrodeposition. The first electrode sheet and the second electrode sheet are electrically insulated from each other and are connected to a power source and a heat-generating device to form a conductive circuit loop.