Patents by Inventor David Ciufo

David Ciufo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming vias on printed circuit boards
    Patent number: 9999137
    Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 12, 2018
    Assignee: Intrinsiq Materials, Inc.
    Inventors: David Ciufo, Janet Heyen
  • METHOD FOR FORMING VIAS ON PRINTED CIRCUIT BOARDS
    Publication number: 20160128201
    Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.
    Type: Application
    Filed: November 3, 2015
    Publication date: May 5, 2016
    Inventors: David Ciufo, Janet Heyen