Abstract: A method of patterning a substrate includes exposing a photoresist layer on the substrate with a pattern of actinic radiation to form a chemically reactive surface pattern, and coating, at the track system, a spin-on-material to convert the chemically reactive surface pattern to a photoresist surface mask pattern. The method further includes etching the photoresist layer using the photoresist surface mask pattern as a first etch mask to form a photoresist mask pattern, and etching a layer to be etched with the photoresist mask pattern as a second etch mask.

Abstract: A process includes forming, over a dielectric layer, a hardmask stack including a first layer below a second layer below a third layer below a fourth layer. The first and third layers include a different hardmask material from the second and fourth layers. A trench pattern including sidewall spacer structures is formed over the hardmask stack. The fourth layer is etched in a first region. The fourth and third layers are etched in a second region. The fourth and third layers are etched in a third region. The fourth layer is etched in a fourth region. The second and first layers are etched in the second and third regions. The third layer is etched in the first and fourth regions. In the dielectric layer, trenches are formed in the first and fourth regions, and via openings, deeper than the trenches, are formed in the second and third regions.

Abstract: A method of patterning an underlying layer that includes: depositing a metal-free polymer film over the underlying layer, exposing the film to an EUV to form an exposed region and a masked region of the film, the exposed region photoreacting to the EUV; selectively dry etching first portions of the film to form features including the remaining second portions of the film, an etch rate of the first portions being greater than that of the second portions of the film, the first portions being one of the exposed region and the masked region, the second portions being another of the exposed region and the masked region that is not the first portion, where a pitch of the features is below the feature size achievable with a 193 nm immersion lithography tool in a single patterning process; and patterning the underlying layer using the second portion as an etch mask.

Abstract: A method of patterning a substrate, where the method includes: forming first structures over a memorization layer, the first structures including a first row of lines that are parallel with each other and spaced apart from each other; executing a first anti-spacer formation process to form first trenches along sidewalls of the first structures and sidewalls of a first fill material, the first trenches defining a first etch pattern; transferring the first etch pattern into the memorization layer and removing materials above the memorization layer; forming second structures over the memorization layer, the second structures including a second row of lines that are parallel with each other and spaced apart, placement of the second row of lines being shifted relative to the first row of lines; executing a second anti-spacer formation process to form second trenches formed along sidewalls of the second structures and sidewalls of a second fill material, the second trenches defining a second etch pattern; and trans

Abstract: A method of patterning a substrate by selective deprotection via dye diffusion. The method includes forming a photoresist pattern on the substrate from a layer of photoresist deposited on the substrate, depositing a first overcoat on the photoresist pattern, the first overcoat filling openings defined by the photoresist pattern and covering the photoresist pattern, the first overcoat including an organic film containing a dye. The method further includes diffusing the dye from the first overcoat a predetermined diffusion length into the photoresist pattern, resulting in diffusion regions in the photoresist pattern, and removing the first overcoat from the substrate. The method further includes activating the solubility-shifting agent in the diffusion regions of the photoresist pattern using a second actinic radiation, depositing a second overcoat on the substrate, and developing the substrate with a second developer resulting in removal of soluble portions of the diffusion regions of the photoresist pattern.

Abstract: Aspects of the present disclosure provide an imaging system. For example, in the imaging system a first light source can generate a first light beam of a first wavelength, a second light source can generate a second light beam of a second wavelength, the second light beam having power sufficient to pass through at least a portion of a thickness of a wafer, an alignment module can coaxially align the second light beam with the first light beam, a coaxial module can focus the coaxially aligned first and second light beams onto a first pattern located on a front side of the wafer and a second pattern located below the first pattern, respectively, and an image capturing module can capture a first image of the first pattern and a second image of the second pattern. The second image can be captured via quantum tunneling imaging or infrared (IR) transmission imaging.

Abstract: Techniques herein include methods for forming a direct write, tunable stress film and methods for correcting wafer bow using said stress film. The method can be executed on a coater-developer tool or track-based tool. The stress film can be based on a film that undergoes crosslinking/decrosslinking under external stimulus where direct write is achieved by, but is not limited to, 365 nm exposure and subsequent cure is used to “pattern-in” stress. No develop step may be required, which provides additional significant benefit in conserving film planarity. An amount of bow (or internal stress to create or affect a bow signature) can be tuned with exposure dose, bake temperature, bake time and number of bakes.

Abstract: Embodiments of the invention are directed to a sub-surface irrigation system configured to operate in a plant-responsive mode, and further configured to make certain adaptations in response to plant stress. Stress adaptations may include, for example, selectively increasing source pressure of irrigation fluid, heating or chilling the irrigation fluid, and/or injecting fertilizer and/or non-fertilizer amendments into the irrigation fluid.

Abstract: Aspects of the present disclosure provide an inspection system, which can include an image module and processing circuitry. The imaging module can image a wafer with a first light beam and a second light beam. The first light beam can be coaxially aligned with the second light beam, and image a first pattern located on a front side of a wafer to form a first image. The second light beam can image a second pattern located below the first pattern to form a second image via quantum tunneling imaging or infrared transmission imaging. The second light beam can have power sufficient to pass through at least a portion of a thickness of the wafer and reach the second pattern. The processing circuitry can perform image analysis on the first image and the second image to calculate an overlay value of the first and second patterns and/or defects of the wafer.

Abstract: Aspects of the present disclosure provide an imaging system. For example, in the imaging system a first light source can generate a first light beam of a first wavelength, a second light source can generate a second light beam of a second wavelength, the second light beam having power sufficient to pass through at least a portion of a thickness of a wafer, an alignment module can coaxially align the second light beam with the first light beam, a coaxial module can focus the coaxially aligned first and second light beams onto a first pattern located on a front side of the wafer and a second pattern located below the first pattern, respectively, and an image capturing module can capture a first image of the first pattern and a second image of the second pattern. The second image can be captured via quantum tunneling imaging or infrared (IR) transmission imaging.

Abstract: Features of relatively low pressure microporous (and preferably plant-responsive) irrigation tubes are combined with features of relatively high pressure drip emitter tubes to produce a hybrid irrigation tube. Methods for using and manufacturing the hybrid irrigation tube are also disclosed.

Abstract: Features of relatively low pressure microporous (and preferably plant-responsive) irrigation tubes are combined with features of relatively high pressure drip emitter tubes to produce a hybrid irrigation tube. Methods for using and manufacturing the hybrid irrigation tube are also disclosed.

Abstract: An electronic flying insect trap apparatus having a housing topped by an aperture with sufficient openings as to allow flying insects to pass through it and side apertures of the apparatus and a bottom plate, the housing and bottom plate having sufficient openings as to allow air to pass therethrough and disseminate a scent. At least one light positioned below the top aperture. A truncated conical collar below the light. At least one fan positioned below the collar. A tray containing sticky adhesive disposed on the upper surface of a disposable sheet positioned below the fan. At least one motion detector is in communication with the fan.

Abstract: The invention is directed generally to improvements in irrigation and fertilization assessment and delivery. More specifically, embodiments of the invention provide an improved fluid delivery tube, method to manufacture such tube, and systems that include such tube. The delivery tube is beneficial at least because it minimizes the life cycle cost of a responsive delivery tube.

Abstract: The invention is directed generally to improvements in irrigation and fertilization assessment and delivery. More specifically, embodiments of the invention provide an improved fluid delivery tube, method to manufacture such tube, and systems that include such tube. The delivery tube is beneficial at least because it minimizes the life cycle cost of a responsive delivery tube.

Abstract: The invention is directed generally to improvements in irrigation and fertilization assessment and delivery. More specifically, embodiments of the invention provide an improved fluid delivery tube, method to manufacture such tube, and systems that include such tube. The delivery tube is beneficial at least because it minimizes the life cycle cost of a plant-responsive delivery tube.

Abstract: The invention is directed generally to improvements in irrigation and fertilization assessment and delivery. More specifically, embodiments of the invention provide an improved fluid delivery tube, method to manufacture such tube, and systems that include such tube. The delivery tube is beneficial at least because it minimizes the life cycle cost of a responsive delivery tube.

Abstract: The invention is directed generally to improvements in irrigation and fertilization assessment and delivery. More specifically, embodiments of the invention provide an improved fluid delivery tube, method to manufacture such tube, and systems that include such tube. The delivery tube is beneficial at least because it minimizes the life cycle cost of a plant-responsive delivery tube.

Abstract: An electro-optical device includes a substrate on which first and second electrodes are formed. A plurality of nanoparticles are arrayed on the surface of the substrate between the first and second electrodes. The arrayed nanoparticles exhibit plasmonic activity in at least one wavelength band. A plurality of linking molecules are coupled between respective adjacent ones of the nanoparticles and between each of the electrodes and nanoparticles that are adjacent to the electrodes. The linking molecules are selected to exhibit photo-activity that is complementary to the arrayed nanoparticles.

Abstract: Disclosed are electronic, plasmonic and opto-electronic components that are prepared using patterned photodeposited nanoparticles on a substrate surface. Also disclosed are ferroelectric nanolithography methods for preparing components, circuits and devices.