Patents by Inventor David Crotzer

David Crotzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mitigating the effects of defects in high temperature semiconductor wires
    Patent number: 8680015
    Abstract: A method includes locating a defect in a first segment of high temperature superconducting wire. A second segment of high temperature superconducting wire is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: March 25, 2014
    Assignee: American Superconductor Corporation
    Inventors: Henry C. Valcour, III, Peter D. Antaya, John Gannon, Eric R. Podtburg, Subramaniam Anandakugan, William L. Carter, Hong Cai, Michael A. Tanner, David Crotzer, Alexander Otto, Dana Krause
  • MITIGATING THE EFFECTS OF DEFECTS IN HIGH TEMPERATURE SUPERCONDUCTOR WIRES
    Publication number: 20120245035
    Abstract: A method includes locating a defect in a first segment of high temperature superconducting wire. A second segment of high temperature superconducting wire is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 27, 2012
    Applicant: American Superconductor Corporation
    Inventors: Eric R. Podtburg, Henry C. Valcour, III, Subramaniam Anandakugan, Peter D. Antaya, William L. Carter, John Gannon, Hong Cai, Michael A. Tanner, David Crotzer, Alexander Otto, Dana Krause
  • Resilient electrical interconnects having non-uniform cross-section
    Patent number: 6348659
    Abstract: Resilient electrical interconnects are provided which have a non-uniform cross section which achieves an increased range of deflection and a predetermined relationship between compression force and deflection of the interconnect, and between resistance and deflection of the interconnect. A smaller cross sectional area decreases the spring rate, or compression force, of the interconnect during compression. Increased range of deflection and reduced spring rate enables improved compensation for surface irregularities and facilitates mounting of integrated circuit or other devices having large arrays of interconnects. The non-uniform cross section is provided by a single or compound slope, or alternatively a nonlinear curve, from the end of smaller cross-section to the end of larger cross-section.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: February 19, 2002
    Assignee: Thomas & Betts International, Inc.
    Inventors: David Crotzer, David DeDonato, Jonathan Goodwin, Stephen Delprete