Abstract: The invention provides in some aspects a system for display of context-aware content that includes a server storing context-sensitive data, a player that is persistently or, at least intermittently, coupled to the server, and that is likewise coupled to a plurality of output devices—such as, for example, electronic shelf labels, personal digital assistants, mobile phones, and LCD, LED or other fixed displays. The player responds to the context of each of the plurality of output devices by obtaining from the server data germane to that context, storing that data or content germane to that context generated from that data, and driving that content to that output device for presentation thereon, wherein the player concurrently drives different content to at least two of said output devices.

Abstract: The invention provides in some aspects a system for display of context-aware content that includes a server storing context-sensitive data, a player that is persistently or, at least intermittently, coupled to the server, and that is likewise coupled to a plurality of output devices—such as, for example, electronic shelf labels, personal digital assistants, mobile phones, and LCD, LED or other fixed displays. The player responds to the context of each of the plurality of output devices by obtaining from the server data germane to that context, storing that data or content germane to that context generated from that data, and driving that content to that output device for presentation thereon, wherein the player concurrently drives different content to at least two of said output devices.

Abstract: A method for fabricating parts using a photolithography system, includes: performing a search of normalization data for an estimated dose operating point; and using the estimated dose operating point for fabrication of new parts.

Abstract: A method for fabricating parts using a photolithography system, includes: performing a search of normalization data for an estimated dose operating point; and using the estimated dose operating point for fabrication of new parts. Other methods are provided.

Abstract: Disclosed are methods and systems for estimating a reticle bias state for a process system, that include computing a difference between control data provided to the process system and error data based on a process system output(s), and estimating the reticle bias state based on weighted measures associated with the control data, the weighted measures being based on the number of data points included in the difference. The methods and systems include associating the reticle bias state estimate with a first quality factor, computing at least one weighted measure based on a number of data elements associated with the reticle, using the weighted measure(s) to provide a computed reticle bias state estimate and an associated computed quality factor, and, comparing the computed quality factor with the first quality factor to determine whether to update the reticle bias state estimate with the computed reticle bias state estimate.

Abstract: Systems and methods for controlling at least one reticle-induced error in a process system, the systems and methods including adjusting measurement data associated with the process system, where the adjustment can be based on at least one reticle identifier (ID) associated with the measurement data, and reticle-induced error data associated with the at least one reticle ID. The methods and systems also include combining the adjusted measurement data to compute at least one control for the process system.

Abstract: Disclosed are methods and systems for estimating a reticle bias state for a process system, that include computing a difference between control data provided to the process system and error data based on a process system output(s), and estimating the reticle bias state based on weighted measures associated with the control data, the weighted measures being based on the number of data points included in the difference. The methods and systems include associating the reticle bias state estimate with a first quality factor, computing at least one weighted measure based on a number of data elements associated with the reticle, using the weighted measure(s) to provide a computed reticle bias state estimate and an associated computed quality factor, and, comparing the computed quality factor with the first quality factor to determine whether to update the reticle bias state estimate with the computed reticle bias state estimate.

Abstract: A dental marking film holder holds articulating film in a patient's mouth, reducing the number of hands needed for the procedure. A pair of safety glasses worn by the patient includes a mounting point for affixing a mount to. In some embodiments, the mount is a clamp that attaches to the bridge of the glasses. In other embodiments, a mounting point on the glasses forms a ball-and-socket joint with the mount. The mount is connected to an articulating film holder by a flexible coupling. The flexible coupling provides for adapting to the geometry of an individual's face and for stably holding the articulating film holder at a range of positions. The articulating film holder accepts forceps that hold articulating film. In some embodiments, the articulating film includes disposable forceps. The articulating film holder adapts to a range of dental arch widths.

Abstract: Apparatus supported on the brow beam of protective eye glasses worn by a dental patient provides a moveably positionable holder arm depending spacedly forward of a user's nose and spacedly below the user's mouth. The holder arm carries marking film holding structure for vertically adjustable frictional motion thereon. The marking film holding structure provides two pivotally interconnected holder arms extending toward the patient's mouth for adjustable frictional motion in a horizontal plane through the patient's mouth and substantially perpendicular to the holder arm. The holder arms releasably carry dental marking film structures having dental marking film supported by a rigid back releasably carried by the holder arms to allow marking of contact points of teeth of the opposed dental arches upon appropriate manipulation.

Abstract: Systems and methods for controlling at least one reticle-induced error in a process system, the systems and methods including adjusting measurement data associated with the process system, where the adjustment can be based on at least one reticle identifier (ID) associated with the measurement data, and reticle-induced error data associated with the at least one reticle ID. The methods and systems also include combining the adjusted measurement data to compute at least one control for the process system.

Abstract: Methods and systems for controlling critical dimension (CD) in a process system, including computing an exposure dose error based on at least one output of the process system, normalizing the computed exposure dose error based on a target exposure dose, and providing an exposure dose to the process system based on at least one normalized exposure dose error. The target exposure dose can be associated with a process system characteristic(s) and can be updated based on normalized computed exposure dose errors.

Abstract: Methods for monitoring defects in a process for forming a contact hole, via or trench in a layer of a device in an integrated circuit includes the steps of forming a sacrificial topology on a substrate by duplicating at least a portion of a structure of the device while substituting a material substantially free of elemental silicon for any elemental silicon present in the device to be monitored, etching the sacrificial topology at least to the substrate, removing at least a portion of the sacrificial topology, and inspecting the substrate using a wafer surface inspection tool. The substituted material, such as a dielectric material, can be easily etched and removed from the substrate, as compared to polysilicon. The etching step preferably creates an indentation in the substrate that is readily detectable by the wafer surface inspection tool. The etching step is preferably a selective etching step, having a selectivity of at least 10:1.

Abstract: Methods for monitoring defects in a process for forming a contact hole, via or trench in a layer of a device in an integrated circuit includes the steps of forming a sacrificial topology on a substrate by duplicating at least a portion of a structure of the device while substituting a material substantially free of elemental silicon for any elemental silicon present in the device to be monitored, etching the sacrificial topology at least to the substrate, removing at least a portion of the sacrificial topology, and inspecting the substrate using a wafer surface inspection tool. The substituted material, such as a dielectric material, can be easily etched and removed from the substrate, as compared to polysilicon. The etching step preferably creates an indentation in the substrate that is readily detectable by the wafer surface inspection tool. The etching step is preferably a selective etching step, having a selectivity of at least 10:1.

Abstract: An optical assembly structure wherein miniature optical components such as lasers, modulators, lenses, thin-film and fiber-optic waveguides, and photodetectors are critically aligned and supported for coactive operation by means of two or more wafers which are formed with complementary grooves and mortises to support the loose optical components such as lenses and fiber-optic waveguides and to receive alignment rails to insure the relativity of the wafers, which also have formed integral therewith optical elements such as waveguides, modulators, and lasers, to produce an integrated optical assembly somewhat in the manner of an "optical bench," wherein the bench structure also provides an active optical element.

Abstract: An optical structure for the bidirectional coupling of light between each of a multiplicity of optical fibers and corresponding individual thin-film waveguides to achieve a leaky wave coupling from one guided mode structure to a second guided mode structure. The structure is particularly suited for fabrication by planar deposition and etching techniques and features the precise axial alignment of the optical elements by inserting the fibers in etched V-grooves in the substrate upon which are deposited the waveguides.