Abstract: The invention is a method for testing an electronic device (10) of the type having on one side thereof an array of conductive projections, such as solder balls (15), arranged in a first configuration. An array of spring-loaded probes (25) is arranged in the first configuration. An insulative template (18) is formed comprising an array of apertures (19) arranged in the first configuration which is aligned with the spring-loaded conductive probes. The electronic device (10) is then forced against the template (18) such that each solder ball (15) projects into the aperture to contact a spring-loaded conductive probe (25). Electrical current is passed through at least part of the electronic device, at least some of the solder balls, and at least some of the conductive probes as is required for electrical testing of the electronic device.

Abstract: A method for testing an integrated circuit (IC) chip (10) in accordance with the invention comprises the step of forming a solder bump (14) on each of an array of bonding pads (13) on a first surface of the chip, in accordance with the known flip-chip method of IC device packaging. Each of the solder bumps (14) is inserted through an aperture (25) in a spacer member (22), the spacer member having a smaller thickness than the length of each solder bump, whereby each solder bump protrudes through an aperture. The solder bumps are then placed on a layer of anisotropic conductive material (11) which is arranged over an array of test fixture conductive pads so that the anisotropic conductive layer is sandwiched between the IC chip and the test fixture. The integrated circuit chip is then compressed against the anisotropic conductor material to establish electrical contact between the solder bumps of the integrated circuit chip and the test fixture conductor pads (17).