Patents by Inventor David D. Dearborn

David D. Dearborn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging system for field effects transistors
    Patent number: 5917236
    Abstract: A packaging system for field effect transistor ("FET") dies is described. Individual FET dies are eutectically bonded to individual FET mounting bars. The mounting bar/FET die combination is then eutectically bonded, along with the other components comprising the package, to a package base. After a wiring operation, the package is completed by sealing it with a cover. This packaging system has many fewer parts than known FET packages, permits the economical correction of micro-voids between the FET dies and the mounting bars, and is significantly less expensive than known FET packages.
    Type: Grant
    Filed: December 8, 1995
    Date of Patent: June 29, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Charles C. Leader, III, David D. Dearborn, Shantanu Mitra