Patents by Inventor David D. Oliver

David D. Oliver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding a semiconductor wafer
    Patent number: 6113721
    Abstract: Removing a portion of an active wafer (12) at the edge (18) after the active wafer (12) is bonded to a base wafer (10) prevents chipping of the edge of the active wafer during thinning of the active wafer (12). Grinding and polishing of the edges of the active wafer (12) is preferably performed.
    Type: Grant
    Filed: January 3, 1995
    Date of Patent: September 5, 2000
    Assignee: Motorola, Inc.
    Inventors: Frank T. Secco d'Aragona, David D. Oliver, Raymond C. Wells