Patents by Inventor David D. OLMOZ

David D. OLMOZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip packages and sinterable paste for use with thermal interface materials
    Patent number: 11404349
    Abstract: In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: August 2, 2022
    Assignee: Intel Corporation
    Inventors: Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Ken P. Hackenberg, Nayandeep K. Mahanta, David D. Olmoz
  • MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTERFACE MATERIALS
    Publication number: 20190267306
    Abstract: In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.
    Type: Application
    Filed: December 7, 2016
    Publication date: August 29, 2019
    Applicant: Intel Corporation
    Inventors: Nachiket R. RARAVIKAR, Ravindranath V. MAHAJAN, Robert L. SANKMAN, James C. MATAYABAS, Jr., Ken P. HACKENBERG, Nayandeep K. MAHANTA, David D. OLMOZ