Patents by Inventor David D. Rye

David D. Rye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210155522
    Abstract: An exhaust conduit for a glass melt system includes a corrosion resistant refractory conduit material, such as a conduit material including zirconia. The conduit can extend through a relatively dense refractory block material, such as a refractory block comprising alumina. The exhaust conduit can exhibit improved corrosion resistance in processing a variety of glass melt compositions.
    Type: Application
    Filed: April 4, 2019
    Publication date: May 27, 2021
    Inventors: Gloria Heeyeon An, Mark Alan Cook, Raymond Eugene Fraley, Pierre Laronze, John Arthur Medford, David D Rye
  • Patent number: 8821013
    Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: September 2, 2014
    Assignee: Corning Incorporated
    Inventors: Daniel R Boudreault, Kenneth P Ehrlich, David D Rye
  • Publication number: 20120106594
    Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.
    Type: Application
    Filed: May 12, 2011
    Publication date: May 3, 2012
    Inventors: Daniel R. Boudreault, Kenneth P. Ehrlich, David D. Rye