Patents by Inventor David D. Senk
David D. Senk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7935895Abstract: Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.Type: GrantFiled: September 26, 2006Date of Patent: May 3, 2011Assignee: Cisco Technology, Inc.Inventors: David D. Senk, Joe D. Dickson
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Publication number: 20090188710Abstract: Methods and apparatus for creating a filled, backdrilled plated through hole in a printed circuit board are disclosed. According to one aspect of the present invention, a method includes defining a hole in a printed circuit board panel. The hole has a first surface, and includes at least a first portion and a second portion. The method also includes plating the first surface with a conductive material, to create a plated surface, and removing at least a first area of the plated surface. The first area of the plated surface is associated with the second portion, and removing the first area of the plated surface includes expanding a size of the hole associated with the second portion. Finally, the method includes filling the hole with a non-conductive material.Type: ApplicationFiled: January 30, 2008Publication date: July 30, 2009Applicant: CISCO TECHNOLOGY, INC.Inventor: David D. Senk
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Publication number: 20080073113Abstract: Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.Type: ApplicationFiled: September 26, 2006Publication date: March 27, 2008Applicant: CISCO TECHNOLOGY, INC.Inventors: DAVID D. SENK, JOE D. DICKSON
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Patent number: 6994757Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.Type: GrantFiled: June 21, 2004Date of Patent: February 7, 2006Assignee: Shipley Company, L.L.C.Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
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Patent number: 6846370Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent or iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.Type: GrantFiled: July 3, 2002Date of Patent: January 25, 2005Assignee: Shipley Company, L.L.C.Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
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Publication number: 20040257193Abstract: Resistive materials have resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.Type: ApplicationFiled: October 17, 2003Publication date: December 23, 2004Applicant: Shipley Company, L.L.C.Inventors: Craig S. Allen, Andrew T. Hunt, Wen-Yi Lin, David D. Senk, John Schemenaur
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Publication number: 20040231757Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.Type: ApplicationFiled: June 21, 2004Publication date: November 25, 2004Applicant: Shipley Company, L.L.C.Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
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Publication number: 20030121883Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.Type: ApplicationFiled: July 3, 2002Publication date: July 3, 2003Applicant: Shipley Company, L.L.C.Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
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Publication number: 20030016117Abstract: Resistive materials having resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.Type: ApplicationFiled: May 17, 2002Publication date: January 23, 2003Applicant: Shipley Company, L.L.C.Inventors: David D. Senk, John Schemenaur, Wen-Yi Lin, Andrew T. Hunt
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Publication number: 20030016118Abstract: Resistors having a resistive material portion including multiple layers or resistive materials, wherein each layer of resistive material has a different sheet resistivity, are provided by the present invention. Such resistors are particularly useful as embedded resistors in the manufacture of printed wiring boards. Methods of preparing such resistors are also provided.Type: ApplicationFiled: May 17, 2002Publication date: January 23, 2003Applicant: Shipley Company, L.L.C.Inventors: John Schemenaur, David D. Senk
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Publication number: 20030001719Abstract: Resistive materials having a plurality of perforations are provided. Such resistive materials are useful in the manufacture of resistors. These resistors are particularly suitable for use as resistors embedded in printed wiring boards.Type: ApplicationFiled: May 17, 2002Publication date: January 2, 2003Applicant: Shipley Company, L.L.C.Inventors: John Schemenaur, David D. Senk