Abstract: A quantum object confinement apparatus is provided comprising one or more electrode sequences and a voltage control circuit for providing analog control signals to at least a first symmetric pair of control electrodes of one of the electrode sequences. The voltage control circuit (i) selectively closes one of a first plurality of switches to complete an electrical connection between the voltage control circuit and a first symmetric control electrode and (ii) simultaneously selectively closes one of a second plurality of switches to complete an electrical connection between the voltage control circuit and a second symmetric control electrode. The voltage control circuit applies a same voltage to an input of the one of the first plurality of switches and to an input of the one of the second plurality of switches prior to selectively closing and as the switches close.

Abstract: A confinement apparatus package is provided. The confinement apparatus chip includes a confinement apparatus die having a plurality of electrodes formed thereon, wherein the plurality of electrodes defines a confinement apparatus; an application-specific integrated circuit (ASIC) chip comprising an ASIC die having an ASIC formed thereon; and a package substrate. The ASIC die is disposed between the package substrate and the confinement apparatus die. The ASIC defines a plurality of electrical channels and each electrode of the plurality of electrodes is in electrical communication with a respective electrical channel of the plurality of electrical channels.

Abstract: A quantum object confinement apparatus comprising one or more high-voltage semiconductor switches is provided. Each switch comprises a transmission gate portion, a gate driver portion, a current distribution portion, and a logic enable portion. The transmission gate portion comprises two transistors connected in series source-to-source or drain-to-drain. The gate driver portion detects a voltage at the switch input terminal and the switch output terminal and applies a bias voltage to the gates of the two transistors of the transmission gate portion that is a predetermined amount above a lesser or a greater of the voltage at the switch input terminal or the voltage at the switch output terminal.

Abstract: A low loss silicon nitride film is formed by depositing a silicon nitride film on a substrate and annealing the silicon nitride film for at least ten hours at a temperature of at least 400° C. to cause the silicon nitride film to become a low loss silicon nitride film. The low loss silicon nitride film has an optical loss of less than 1 dB per cm at a wavelength of 488 nm.

Abstract: An ion trap apparatus (e.g., ion trap chip) having a plurality of electrodes is provided. The ion trap apparatus may comprise a plurality of interconnect layers, a substrate, and at least one integrated switching network layer disposed between the plurality of interconnect layers and the substrate. The integrated switching network layer may comprise a plurality of monolithically-integrated controls and/or switches configured to condition a voltage signal applied to at least one of the plurality of electrodes. An example ion trap apparatus may comprise a surface ion trap chip. The ion trap apparatus may be configured to operate within a cryogenic chamber.

Abstract: An ion trap apparatus (e.g., ion trap chip) having a plurality of electrodes is provided. The ion trap apparatus may comprise a plurality of interconnect layers, a substrate, and at least one integrated switching network layer disposed between the plurality of interconnect layers and the substrate. The integrated switching network layer may comprise a plurality of monolithically-integrated controls and/or switches configured to condition a voltage signal applied to at least one of the plurality of electrodes. An example ion trap apparatus may comprise a surface ion trap chip. The ion trap apparatus may be configured to operate within a cryogenic chamber.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.