Patents by Inventor David DeGrappo

David DeGrappo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040012937
    Abstract: A process for manufacturing a Printed Circuit Board (PCB) substrate with passive electrical components (e.g., capacitors, inductors and/or resistors) includes weaving a plurality of dielectric strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric. The woven fabric is impregnated with a dielectric resin material to form an impregnated fabric and, thereafter, the impregnated fabric is cured to form a cured fabric. The cured fabric's upper and lower surfaces are then planed. The planing of the upper and lower surface segments the electrically conductive strands and forms a PCB substrate with a passive electrical component (e.g., a capacitor and/or inductor) therein. The passive electrical component(s) includes electrically isolated conductive strand segments separated by at least one of the dielectric resin material and the dielectric strands.
    Type: Application
    Filed: July 18, 2002
    Publication date: January 22, 2004
    Applicant: KULICKE & SOFFA INVESTMENTS, INC.
    Inventors: David DeGrappo, Richard Dow, Timothy W. Ellis