Abstract: This invention reveals functional particle co-embedded multi-phase hierarchical porous nanostructured polymer composites, along with all-in-one getter assemblies tailored to manage particulate and gaseous emissions, particularly from microelectronic and electronic packages, as well as various industrial systems. The getter assemblies, available in single-layered, bilayered, and multilayered configurations, offer customized solutions to address specific emission control challenges in diverse environments.

Abstract: This disclosure presents multi-phase hierarchical porous nanostructure-based polymer composites and associated getter assemblies designed for scavenging multi-gas and organic compounds outgassed from electronic packages, devices, and modules. The composites integrate hydrophilic microporous, hydrophobic microporous, and hydrophobic mesoporous nanoparticles within a polymer matrix to form binary, ternary, or quaternary multi-phase structures. These polymer composites are utilized to fabricate getter assemblies featuring single-layer, bi-layer, or multi-layer configurations on a substrate. The assemblies are tailored to selectively target specific polar and non-polar gases and organic compounds or to adsorb a broad spectrum of outgassed emissions, irrespective of their polarity, molecular size, or surface energy characteristics.

Abstract: Getters for hydrocarbons (HCs) and volatile organic compounds (VOCs) designed for microelectronic and electronic packages are disclosed. These getters feature a hierarchical porous nanostructured polymer composite layer supported by a substrate. The composite layer integrates hydrophilic microporous nanoparticles and hydrophobic mesoporous nanoparticles, enabling the modulation of hydrophilic and hydrophobic properties. This tailored structure facilitates the effective absorption of a broad spectrum of polar and non-polar HCs and VOCs, for enhancing the reliability and performance of electronic packages by controlling outgassed emissions.

Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.

Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.