Abstract: There is disclosed an integrated circuit package assembly for housing an integrated circuit die wherein the integrated circuit package assembly affords substantially reduced ground bounce within the integrated circuit. The package assembly includes a planar electrically conductive sheet upon which the integrated circuit die is insulatively bonded. The integrated circuit package includes at least one ground lead which is coupled to a conductive ground pad on the integrated circuit by a first ground wire which connects the ground pad to the electrically conductive sheet and a second bond wire which connects the electrically conductive sheet to the ground lead. The assembly is completed by an encapsulation which encapsulates the integrated circuit die, the electrically conductive sheet, the first and second bond wires, and a portion of the ground lead.