Abstract: A method is provided for fabricating an image sensor array in a manner that reduces the potential for defects resulting from electrostatic discharge events during fabrication of the image sensor array. The method includes: forming at least one pixel over a substrate, the pixel including a switching transistor and a photo-sensitive cell; and forming a dielectric interlayer over the pixel. A key step in the method of the present invention is depositing a first conductive layer over the dielectric interlayer. After the first conductive layer is formed, the image sensor array is well protected from ESD events because the first conductive layer spreads out any charge induced by tribo-electric charging events that may occur during subsequent fabrication processing steps, thereby reducing the potential for localized damage to the switching transistors upon the occurrence of ESD events.

Abstract: A method is provided for fabricating an image sensor array in a manner that reduces the potential for defects resulting from electrostatic discharge events during fabrication of the image sensor array. The method includes: forming at least one pixel over a substrate, the pixel including a switching transistor and a photo-sensitive cell; and forming a dielectric interlayer over the pixel. A key step in the method of the present invention is depositing a first conductive layer over the dielectric interlayer. After the first conductive layer is formed, the image sensor array is well protected from ESD events because the first conductive layer spreads out any charge induced by tribo-electric charging events that may occur during subsequent fabrication processing steps, thereby reducing the potential for localized damage to the switching transistors upon the occurrence of ESD events.

Abstract: A method is provided for fabricating an image sensor array in a manner that reduces the potential for defects resulting from electrostatic discharge events during fabrication of the image sensor array. The method includes: forming at least one pixel over a substrate, the pixel including a switching transistor and a photo-sensitive cell; and forming a dielectric interlayer over the pixel. A key step in the method of the present invention is depositing a first conductive layer over the dielectric interlayer. After the first conductive layer is formed, the image sensor array is well protected from ESD events because the first conductive layer spreads out any charge induced by tribo-electric charging events that may occur during subsequent fabrication processing steps, thereby reducing the potential for localized damage to the switching transistors upon the occurrence of ESD events.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: A pair of rimless eyeglasses are formed with lenses having mounting apertures defined through their structures near both their mutually proximate and mutually remote edges. The mounting wires and mounting apertures are of uniform cross section throughout between the inner and outer surfaces of the lenses. The ends of coupling wires at the bridge and temple pieces are bent back upon themselves to form mounting loops. The ends of the coupling wires at the mounting loops are inserted into the apertures in the lenses. The mounting wires are thereby secured in the apertures by the force of friction. Preferably each mounting aperture is lined with a resilient grommet that conforms to the shape of the aperture and at least partially conforms to the shape of the wire inserted therewithin. The grommets grip the wires and the structure of the lenses at the apertures to stabilize the bridge and temple pieces relative to be lenses.

Abstract: A pair of rimless eyeglasses are formed with lenses having mounting apertures defined through their structures near both their mutually proximate and mutually remote edges. The mounting wires and mounting apertures are of uniform cross section throughout between the inner and outer surfaces of the lenses. The ends of coupling wires at the bridge and temple pieces are bent back upon themselves to form mounting loops. The ends of the coupling wires at the mounting loops are inserted into the apertures in the lenses. The mounting wires are thereby secured in the apertures by the force of friction. Preferably each mounting aperture is lined with a resilient grommet that conforms to the shape of the aperture and at least partially conforms to the shape of the wire inserted therewithin. The grommets grip the wires and the structure of the lenses at the apertures to stabilize the bridge and temple pieces relative to be lenses.

Abstract: The system and method for detecting abnormalities in infusion of parenteral fluid involves producing perturbation of fluid flow by varying the flow rate of the fluid with respect to an equilibrium flow rate, measuring the pressure level, and measuring the pressure of the fluid over a period of time, to determine equilibrium pressure and a pressure response of the fluid to the perturbation, determining an integral of the difference between the equilibrium pressure and the pressure response, determining resistance to fluid flow, determining a second integral of the difference between the pressure response and equilibrium pressure multiplied by time, and determining compliance by dividing the second integral by the first integral. Resistance and compliance values are displayed, and an alarm is generated when the resistance or compliance parameters fall outside of reference ranges.