Patents by Inventor David Doub

David Doub has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Redundant wire bonds for increasing transducer reliability
    Publication number: 20060253027
    Abstract: A method and a system for using redundant wire bonds (24) for increasing the reliability of ultrasound transducers is disclosed. An ultrasound transducer assembly having an ultrasound transducer, an integrated circuit (20), a plurality of wires (24), and a plurality of bond pads is provided. The integrated circuit includes enlarged lead pads for receiving redundant wire bonds. The ultrasoundtransducer includes a plurality of bond pads configured to receive the redundant wire bonds. Connecting wires, forming signal paths, connect the enlarged lead pads with the bond pads.
    Type: Application
    Filed: May 27, 2004
    Publication date: November 9, 2006
    Applicant: Koninklijke Philips Electronics N.V.
    Inventors: Showna Chang, Howell Schwartz, Carmine Decicco, David Doub, Bernard Savord, Francis Gurrie