Abstract: An extreme ultraviolet radiation (EUV) source, including: a vessel having an inner vessel wall and an intermediate focus (IF) region; an EUV collector disposed inside the vessel, the EUV collector including a reflective surface configured to reflect EUV radiation toward the intermediate focus region, the reflective surface configured to directionally face the IF region of the vessel; a showerhead disposed along at least a portion of the inner vessel wall, the showerhead including a plurality of nozzles configured to introduce gas into the vessel; and one or more exhausts configured to remove gas introduced into the vessel, the one or more exhausts being oriented along at least a portion of the inner vessel wall so that the gas is caused to flow away from the EUV collector.

Abstract: Provided herein are devices and methods of processing a sample that include, in several embodiments, rotating one or more microfluidic chips that are mounted on a support plate using a motor driven rotational chuck. By spinning one or more of the microfluidic chips about a common center of rotation in a controlled manner, high flow rates (and high shear forces) are imparted to the sample in a controlled manner. Each microfluidic chip can be rotated 180° on the support plate so that the sample can be run back-and-forth through the microfluidic devices. Because the support plate can be driven at relatively high RPMs, high flow rates are generated within the microfluidic chips. This increases the shear forces on the sample and also decreases the processing time involved as the sample can quickly pass through the shear-inducing features of the microfluidic chip(s).

Abstract: A low power hybrid reverse (LPHR) bandgap reference (BGR) and digital temperature sensor (DTS) or a digital thermometer, which utilizes subthreshold metal oxide semiconductor (MOS) transistor and the PNP parasitic Bi-polar Junction Transistor (BJT) device to form a reverse BGR that serves as the base for configurable BGR or DTS operating modes. The LPHR architecture uses low-cost MOS transistors and the standard parasitic PNP device. Based on a reverse bandgap voltage, the LPHR can work as a configurable BGR. By comparing the configurable BGR with the scaled base-emitter voltage, the circuit can also perform as a DTS with a linear transfer function with single-temperature trim for high accuracy.

Abstract: Provided herein are devices and methods of processing a sample that include, in several embodiments, rotating one or more microfluidic chips that are mounted on a support plate using a motor driven rotational chuck. By spinning one or more of the microfluidic chips about a common center of rotation in a controlled manner, high flow rates (and high shear forces) are imparted to the sample in a controlled manner. Each microfluidic chip can be rotated 180° on the support plate so that the sample can be run back-and-forth through the microfluidic devices. Because the support plate can be driven at relatively high RPMs, high flow rates are generated within the microfluidic chips. This increases the shear forces on the sample and also decreases the processing time involved as the sample can quickly pass through the shear-inducing features of the microfluidic chip(s).

Abstract: Provided herein are devices and methods of processing a sample that include, in several embodiments, rotating one or more microfluidic chips that are mounted on a support plate using a motor driven rotational chuck. By spinning one or more of the microfluidic chips about a common center of rotation in a controlled manner, high flow rates (and high shear forces) are imparted to the sample in a controlled manner. Each microfluidic chip can be rotated 180° on the support plate so that the sample can be run back-and-forth through the microfluidic devices. Because the support plate can be driven at relatively high RPMs, high flow rates are generated within the microfluidic chips. This increases the shear forces on the sample and also decreases the processing time involved as the sample can quickly pass through the shear-inducing features of the microfluidic chip(s).

Abstract: Provided herein are devices and methods of processing a sample that include, in several embodiments, rotating one or more microfluidic chips that are mounted on a support plate using a motor driven rotational chuck. By spinning one or more of the microfluidic chips about a common center of rotation in a controlled manner, high flow rates (and high shear forces) are imparted to the sample in a controlled manner. Each microfluidic chip can be rotated 180° on the support plate so that the sample can be run back-and-forth through the microfluidic devices. Because the support plate can be driven at relatively high RPMs, high flow rates are generated within the microfluidic chips. This increases the shear forces on the sample and also decreases the processing time involved as the sample can quickly pass through the shear-inducing features of the microfluidic chip(s).

Abstract: Provided herein are devices and methods of processing a sample that include, in several embodiments, rotating one or more microfluidic chips that are mounted on a support plate using a motor driven rotational chuck. By spinning one or more of the microfluidic chips about a common center of rotation in a controlled manner, high flow rates (and high shear forces) are imparted to the sample in a controlled manner. Each microfluidic chip can be rotated 180° on the support plate so that the sample can be run back-and-forth through the microfluidic devices. Because the support plate can be driven at relatively high RPMs, high flow rates are generated within the microfluidic chips. This increases the shear forces on the sample and also decreases the processing time involved as the sample can quickly pass through the shear-inducing features of the microfluidic chip(s).

Abstract: An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Abstract: A voltage-controlled oscillator (VCO) of ring-connected stages, where each stage in the VCO has a first set of differential inverters biased by variable bias voltages, and a second set of differential inverters biased by fixed bias voltages. The differential inverters in each stage are connected in parallel with each other. Each set of differential inverters in a stage may contain only one differential inverter. The variable bias voltages are provided by charge pumps and associated circuits as used in well-known self-biasing schemes for phase locked loops. The fixed bias voltages are provided by a biasing circuit, matched to the circuits associated with the charge pumps, but where a fixed control voltage is applied to provide the fixed bias voltages.

Abstract: A voltage-controlled oscillator (VCO) of ring-connected stages, where each stage in the VCO has a first set of differential inverters biased by variable bias voltages, and a second set of differential inverters biased by fixed bias voltages. The differential inverters in each stage are connected in parallel with each other. Each set of differential inverters in a stage may contain only one differential inverter. The variable bias voltages are provided by charge pumps and associated circuits as used in well-known self-biasing schemes for phase locked loops. The fixed bias voltages are provided by a biasing circuit, matched to the circuits associated with the charge pumps, but where a fixed control voltage is applied to provide the fixed bias voltages.

Abstract: An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Abstract: In one embodiment, an apparatus is constituted with a temperature sensing circuit adapted to be coupled to a current sources circuit, and configured to measure a circuit temperature and to generate a temperature-indicating signal in response to the circuit temperature and an adjustable current output by the current sources circuit; a reference voltage circuit to be coupled the current sources circuit and configured to provide a reference signal in response to a reference current output by the current sources circuit; and a trip generator circuit coupled to the temperature sensing circuit and the reference voltage circuit and configured to generate a trip point signal if a difference between the reference and the temperature-indicating signals indicates that a threshold circuit temperature has been reached or exceeded.