Abstract: A hybrid sensor assembly is configured to be mounted on a vehicle to sense structure borne and airborne noises generated as the vehicle travels over the roads. The sensor assembly includes a housing having a circuit board mounted therein, an accelerometer mounted on the circuit board, a microphone mounted on the circuit board, an acoustic port through the housing and in communication with the microphone, and an acoustic fabric attached to the housing over the port. An acoustic shield covers the acoustic port and substantially deters the entry of fluid and debris into the acoustic port.

Abstract: A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin.

Abstract: A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin.

Abstract: A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The pairs of terminals are further aligned with each other so that horizontal faces of the terminals in each pair face each other to thereby promote broadside coupling between horizontal pairs of terminals. The components further include vertical castellations between adjacent terminals in order to provide electrical isolation to adjacent pairs of terminals.

Abstract: A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals.

Abstract: A high speed connector includes a plurality of terminal assemblies in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals.

Abstract: A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals. A dielectric insert is provided between the columns of terminals to thereby influence the broadside coupling between pairs of terminals.

Abstract: A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components has internal cavities that contain terminal assemblies of either plug or receptacle structure and may further include either a plurality of power terminals or differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer support frames. The shell forms a wafer and two such wafers are combined together to form a terminal assembly. The terminal assemblies are identical in shape, other than for an engagement means that serves to hold two subframes together as a single assembly.

Abstract: An implantable medical device and method of pacing provide for switching from a first pacing mode to second pacing mode upon detection of a period of accelerated atrial arrhythmia. Generally, the second pacing mode has an associated predetermined lower pacing rate. At least initially, upon switching from the first pacing mode to the second pacing mode, the predetermined lower pacing rate is adjusted to an elevated adjusted lower rate. Further, this elevated adjusted lower rate may then be decelerated towards a programmed basic pacing rate during a deceleration period. Generally, the programmed basic pacing rate is elevated relative to the predetermined lower pacing rate.

Abstract: An implantable medical device and method of pacing provide for switching from a first pacing mode to second pacing mode upon detection of a period of accelerated atrial arrhythmia. Generally, the second pacing mode has an associated predetermined lower pacing rate. At least initially, upon switching from the first pacing mode to the second pacing mode, the predetermined lower pacing rate is adjusted to an elevated adjusted lower rate. Further, this elevated adjusted lower rate may then be decelerated towards a programmed basic pacing rate during a deceleration period. Generally, the programmed basic pacing rate is elevated relative to the predetermined lower pacing rate.