Abstract: A temperature sensor for accurately measuring a temperature, such as that of a fluid where the temperature is changing, can include a substrate with an exterior surface having a first surface and a second surface spaced by sidewalls. The temperature sensor can include a set of temperature sensor probes along the exterior of the substrate. The temperature sensors can be arranged among a first surface and a second surface of the substrate in order to reduce or eliminate temperature measurement discrepancy.

Abstract: A temperature sensor for accurately measuring a temperature, such as that of a fluid where the temperature is changing, can include a housing with an exterior surface extending between a first end and a second end. The temperature sensor housing can include a set of exterior grooves, which provides for coupling a set of temperature sensor probes along the exterior of the housing with a probe extending at the first end. Additionally, a set of recesses can be formed in the first end for positioning the probes within the recesses. Furthermore, the interior of the housing can be hollow, with a second type of probe extending through the interior between the first end and the second end.

Abstract: A temperature sensor for accurately measuring a temperature, such as that of a fluid where the temperature is changing, can include a housing with an exterior surface extending between a first end and a second end. The temperature sensor housing can include a set of exterior grooves, which provides for coupling a set of temperature sensor probes along the exterior of the housing with a probe extending at the first end. Additionally, a set of recesses can be formed in the first end for positioning the probes within the recesses. Furthermore, the interior of the housing can be hollow, with a second type of probe extending through the interior between the first end and the second end.

Abstract: This invention relates to an article comprising a potted electrical component in a structure, wherein the electrical component is potted in a polyimide composition. The invention also relates to a method of potting electrical components comprising the steps of (1) adding a polyimide precursor to a structure including an electrical component, (2) curing the polyimide precursor to form a polyimide composition encapsulating the electrical component.