Patents by Inventor David E. Day

David E. Day has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7166649
    Abstract: The invention is a pressure sensitive adhesive (PSA) composition, which is the ultraviolet radiation (UV) cured reaction product of a polyester-polyether-based urethane acrylate, one or more acrylate monomers, and a UV photosensitizer. The polyester-polyether-based urethane acrylate is the reaction product of between about 50 and 90 wt-% of a polyester diol having a molecular weight ranging from about 500 to 3200; between about 10 and 50 wt-% of a polyether polyol having a molecular weight ranging from about 1000 to 6000; between about 1 and 5 wt-% of a hydroxy-functional acrylate; and a polyisocyanate.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: January 23, 2007
    Assignee: Ashland Chemical, Inc.
    Inventors: David E. Day, Thomas M. Moy, Vincent J. Pascarella
  • Patent number: 6365650
    Abstract: An adhesive suitable for bonding wood is both heat curable and radio frequency (RF) curable. This adhesive is composed of an isocyanate-terminated prepolymer and hydrolyzed soy protein having a pH of at least about 9 and advantageously from about 9 to 11.5. The weight ratio of prepolymer to soy protein hydrolyzate ranges from about 70:30 to 90:10.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: April 2, 2002
    Assignee: Ashland Chemical Company
    Inventors: Gang-Fung Chen, David E. Day, David Jones
  • Publication number: 20020031669
    Abstract: An adhesive suitable for bonding wood is both heat curable and radio frequency (RF) curable. This adhesive is composed of an isocyanate-terminated prepolymer and hydrolyzed soy protein having a pH of at least about 9 and advantageously from about 9 to 11.5. The weight ratio of prepolymer to soy protein hydrolyzate ranges from about 70:30 to 90:10.
    Type: Application
    Filed: January 24, 2001
    Publication date: March 14, 2002
    Inventors: Gang-Fung Chen, David E. Day, David Jones
  • Patent number: 6231985
    Abstract: An adhesive suitable for bonding wood is both heat curable and radio frequency (RF) curable. This adhesive is composed of an isocyanate-terminated prepolymer and hydrolyzed soy protein having a pH of at least about 9 and advantageously from about 9 to 11.5. The weight ratio of prepolymer to soy protein hydrolyzate ranges from about 70:30 to 90:10.
    Type: Grant
    Filed: May 18, 1999
    Date of Patent: May 15, 2001
    Assignee: Ashland Inc.
    Inventors: Gang-Fung Chen, David E. Day, David Jones
  • Patent number: 6175234
    Abstract: An intermediary device is provided between an eddy current bolt hole inspection machine and an associated eddy current probe to positionally align the probe in each bolt hole to be inspected. A first end of the device is attachable to the eddy current bolt hole inspection machine, and a second end, having a tightening bolt, is attachable to the eddy current probe. A collet associated with the second end of the device secures the probe to the device when the tightening bolt is tightened subsequent to the second end accepting the eddy current probe. An adjustable flange component has a first portion separated from a second portion via a spring wave washer to allow the second portion to move left to right and front to back, relative to the first portion.
    Type: Grant
    Filed: September 17, 1998
    Date of Patent: January 16, 2001
    Assignee: General Electric Company
    Inventors: Carl Granger, Jr., David E. Day, Thomas B. Hewton