Patents by Inventor David E. Dombrowski

David E. Dombrowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932802
    Abstract: Various shaped abrasive particles are disclosed. Each shaped abrasive particle includes a body having at least one major surface and a side surface extending from the major surface.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: March 19, 2024
    Assignee: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Todd M. Cotter, Francois Wagner, Rene G. Demers, Richard J. Klok, Alexandra Marazano, Adam D. Lior, James A. Salvatore, Sujatha K. Iyengar, David F Louapre, Sidath S. Wijesooriya, Ronald Christopher Motta, Gary A. Guertin, Michael D. Kavanaugh, Doruk O. Yener, Jennifer H. Czerepinski, Jun Jia, Frederic Josseaux, Ralph Bauer, Frank J. Csillag, Yang Zhong, James P. Stewart, Mark P. Dombrowski, Sandhya Jayaraman Rukmani, Amandine Martin, Stephen E. Fox, Nilanjan Sarangi, Dean S. Matsumoto
  • Patent number: 7608172
    Abstract: The method manufactures high-purity ferromagnetic sputter targets by cryogenic working the sputter target blank at a temperature below at least ?50° C. to impart at least about 5 percent strain into the sputter target blank to increase PTF uniformity of the target blank. The sputter target blank is a nonferrous metal selected from the group consisting of cobalt and nickel; and the nonferrous metal has a purity of at least about 99.99 weight percent. Finally, fabricating the sputter target blank forms a sputter target having an improved PTF uniformity arising from the cryogenic working.
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: October 27, 2009
    Assignee: Praxair S.T. Technology, Inc.
    Inventors: Andrew C. Perry, Holger J. Koenigsmann, David E. Dombrowski, Thomas J. Hunt
  • Publication number: 20040031546
    Abstract: The method manufactures high-purity ferromagnetic sputter targets by cryogenic working the sputter target blank at a temperature below at least −50° C. to impart at least about 5 percent strain into the sputter target blank to increase PTF uniformity of the target blank. The sputter target blank is a nonferrous metal selected from the group consisting of cobalt and nickel; and the nonferrous metal has a purity of at least about 99.99 weight percent. Finally, fabricating the sputter target blank forms a sputter target having an improved PTF uniformity arising from the cryogenic working.
    Type: Application
    Filed: August 11, 2003
    Publication date: February 19, 2004
    Inventors: Andrew C. Perry, Holger J. Koenigsmann, David E. Dombrowski, Thomas J. Hunt
  • Patent number: 6652668
    Abstract: The method manufactures high-purity ferromagnetic sputter targets by cryogenic working the sputter target blank at a temperature below at least −50° C. to impart at least about 5 percent strain into the sputter target blank to increase PTF uniformity of the target blank. The sputter target blank is a nonferrous metal selected from the group consisting of cobalt and nickel; and the nonferrous metal has a purity of at least about 99.99 weight percent. Finally, fabricating the sputter target blank forms a sputter target having an improved PTF uniformity arising from the cryogenic working.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: November 25, 2003
    Assignee: Praxair S.T. Technology, Inc.
    Inventors: Andrew C. Perry, Holger J. Koenigsmann, David E. Dombrowski, Thomas J. Hunt
  • Patent number: 5901336
    Abstract: A process for bonding a first metal such as beryllium to a second metal such as a copper alloy using a powder metallurgy compositional gradient. According to one aspect of the present invention, a sequence of powder layers is located between beryllium and copper alloy pieces, the layers containing mixtures of a beryllium powder and a copper powder, e.g., of a copper alloy, high purity copper and/or the like. The composition of the layers is adjusted such that the layer adjacent the beryllium piece is beryllium rich, and so that the layers become progressively richer in copper as they get closer to the copper piece. The variation in composition between the pieces produces the compositional gradient. Bonding of the beryllium and copper alloy pieces is then accomplished by a hot consolidation technique such as hot isostatic pressing, vacuum hot pressing, solid state bonding or diffusion bonding at a temperature generally within a range of 500.degree. and 800.degree. C.
    Type: Grant
    Filed: August 30, 1996
    Date of Patent: May 4, 1999
    Assignee: Brush Wellman Inc.
    Inventor: David E. Dombrowski