Patents by Inventor David E. Duarte
David E. Duarte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10247624Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.Type: GrantFiled: October 4, 2016Date of Patent: April 2, 2019Assignee: Intel CorporationInventors: Mohamed A. Abdelmoneum, David E. Duarte, Gregory F. Taylor
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Patent number: 10033402Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.Type: GrantFiled: September 14, 2016Date of Patent: July 24, 2018Assignee: Intel CorporationInventors: Takao Oshita, George L. Geannopoulos, David E. Duarte, J. Keith Hodgson, James S. Ayers, Avner Kornfeld, Jonathan P. Douglas
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Patent number: 9702769Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.Type: GrantFiled: June 11, 2013Date of Patent: July 11, 2017Assignee: Intel CorporationInventors: Mohamed A. Abdelmoneum, David E. Duarte, Gregory F. Taylor
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Publication number: 20170038265Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.Type: ApplicationFiled: October 4, 2016Publication date: February 9, 2017Inventors: Mohamed A. Abdelmoneum, David E. Duarte, Gregory F. Taylor
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Publication number: 20170005670Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.Type: ApplicationFiled: September 14, 2016Publication date: January 5, 2017Inventors: Takao Oshita, George L. Geannopoulos, David E. Duarte, J. Keith Hodgson, James S. Ayers, Avner Kornfeld, Jonathan P. Douglas
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Patent number: 9520895Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.Type: GrantFiled: May 6, 2015Date of Patent: December 13, 2016Assignee: Intel CorporationInventors: Takao Oshita, George L. Geannopoulos, David E. Duarte, J Keith Hodgson, James S. Ayers, Avner Kornfeld, Jonathan P. Douglas
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Patent number: 9470586Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.Type: GrantFiled: June 11, 2013Date of Patent: October 18, 2016Assignee: Intel CorporationInventors: Mohamed A. Abdelmoneum, David E. Duarte, Gregory F. Taylor
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Publication number: 20160233879Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.Type: ApplicationFiled: May 6, 2015Publication date: August 11, 2016Inventors: Takao Oshita, George L. Geannopoulos, David E. Duarte, J. Keith Hodgson, James S. Ayers, Avner Kornfeld, Jonathan P. Douglas
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Patent number: 9065470Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.Type: GrantFiled: December 19, 2012Date of Patent: June 23, 2015Assignee: Intel CorporationInventors: Takao Oshita, George L. Geannopoulos, David E. Duarte, J Keith Hodgson, James S. Ayers, Avner Kornfeld, Jonathan P. Douglas
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Publication number: 20140365156Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 11, 2013Publication date: December 11, 2014Inventors: Mohamed A. Abdelmoneum, David E. Duarte, Gregory F. Taylor
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Publication number: 20140167991Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.Type: ApplicationFiled: December 19, 2012Publication date: June 19, 2014Inventors: Takao Oshita, George L. Geannopoulos, David E. Duarte, J. Keith Hodgson, James S. Ayers, Avner Kornfeld, Jonathan P. Douglas
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Patent number: 8314725Abstract: In one embodiment, an analog-to-digital conversion in an integrated circuit is evaluated by an on-die testing circuit. For example, the on-die test circuit 370 can characterize one or both of the linearity and monotonicity of the digital-to-analog conversion. The value of a conversion output for a digital input code may be compared to the value of a prior conversion output of a prior step to provide digital difference values for each step of a sweep of digital input codes. Digital difference values may be compared to one or more predetermined limits to provide one or more pass/fail tests on-board the die. Other embodiments are described and claimed.Type: GrantFiled: September 15, 2010Date of Patent: November 20, 2012Assignee: Intel CorporationInventors: Paola Zepeda, David E. Duarte, Gregory F. Taylor, Atul Maheshwari
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Publication number: 20120062401Abstract: In one embodiment, an analog-to-digital conversion in an integrated circuit is evaluated by an on-die testing circuit. For example, the on-die test circuit 370 can characterize one or both of the linearity and monotonicity of the digital-to-analog conversion. The value of a conversion output for a digital input code may be compared to the value of a prior conversion output of a prior step to provide digital difference values for each step of a sweep of digital input codes. Digital difference values may be compared to one or more predetermined limits to provide one or more pass/fail tests on-board the die. Other embodiments are described and claimed.Type: ApplicationFiled: September 15, 2010Publication date: March 15, 2012Inventors: Paola ZEPEDA, David E. DUARTE, Gregory F. TAYLOR, Atul MAHESHWARI
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Patent number: 7565258Abstract: In one embodiment, an apparatus is constituted with a temperature sensing circuit adapted to be coupled to a current sources circuit, and configured to measure a circuit temperature and to generate a temperature-indicating signal in response to the circuit temperature and an adjustable current output by the current sources circuit; a reference voltage circuit to be coupled the current sources circuit and configured to provide a reference signal in response to a reference current output by the current sources circuit; and a trip generator circuit coupled to the temperature sensing circuit and the reference voltage circuit and configured to generate a trip point signal if a difference between the reference and the temperature-indicating signals indicates that a threshold circuit temperature has been reached or exceeded.Type: GrantFiled: March 6, 2006Date of Patent: July 21, 2009Assignee: Intel CorporationInventor: David E. Duarte