Patents by Inventor David E Hackleman

David E Hackleman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Creating or removing a conductive layer on an insulator over a semiconductor
    Patent number: 4664746
    Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.
    Type: Grant
    Filed: April 29, 1986
    Date of Patent: May 12, 1987
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Ralph H. Nielsen, Jr., Marzio A. Leban
  • Etching a layer over a semiconductor
    Patent number: 4596627
    Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.
    Type: Grant
    Filed: June 13, 1985
    Date of Patent: June 24, 1986
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Ralph H. Nielsen, Jr., Marzio A. Leban
  • Use of an electronic vernier for evaluation of alignment in semiconductor processing
    Patent number: 4566193
    Abstract: An electronic vernier is presented which detects and quantifies misalignment between layers of material deposited upon a semiconducting wafer. Verniers may be constructed which evaluate alignment between two conducting layers, between two conducting layers and an insulating layer and between a semiconducting layer and a capacitive layer. Circuitry is described which shows how output from a vernier may be detected and quantified in order to evaluate the amount of misalignment.
    Type: Grant
    Filed: July 31, 1984
    Date of Patent: January 28, 1986
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Richard F. Adams, Wayne P. Richling
  • Utilizing controlled illumination for creating or removing a conductive layer from a SiO.sub.2 insulator over a PN junction bearing semiconductor
    Patent number: 4454004
    Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.
    Type: Grant
    Filed: February 28, 1983
    Date of Patent: June 12, 1984
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Ralph H. Nielsen, Jr., Marzio A. Leban