Patents by Inventor David E. Heeley

David E. Heeley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit encapsulation and method therefor
    Patent number: 7859068
    Abstract: A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: December 28, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, David E. Heeley
  • INTEGRATED CIRCUIT ENCAPSULATION AND METHOD THEREFOR
    Publication number: 20100044811
    Abstract: A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
    Type: Application
    Filed: November 3, 2009
    Publication date: February 25, 2010
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, David E. Heeley
  • Integrated circuit encapsulation and method therefor
    Patent number: 7632698
    Abstract: A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: December 15, 2009
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, David E. Heeley
  • INTEGRATED CIRCUIT ENCAPSULATION AND METHOD THEREFOR
    Publication number: 20070269933
    Abstract: A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
    Type: Application
    Filed: May 16, 2006
    Publication date: November 22, 2007
    Inventors: Stephen R. Hooper, David E. Heeley