Abstract: Provided is a system and medical device that includes self diagnosing control switches. The control switch may be slidable within a slot in order to control activation of some function of the medical device. Due to natural wear and tear of movement of a control switch, the distances along the sliding slot that correspond to how much energy is used for the function may need to be adjusted over time in order to reflect the changing physical attributes of the actuator mechanism. The self diagnosing control switches of the present disclosures may be configured to automatically adjust for these thresholds using, for example, Hall effect sensors and magnets. In addition, in some cases, the self diagnosing control switches may be capable of indicating external influences on the controls, as well as predict a time until replacement is needed.

Abstract: Various methods and devices are provided for allowing multiple surgical instruments to be inserted into sealing elements of a single surgical access device. The sealing elements can be movable along predefined pathways within the device to allow surgical instruments inserted through the sealing elements to be moved laterally, rotationally, angularly, and vertically relative to a central longitudinal axis of the device for ease of manipulation within a patient's body while maintaining insufflation.

Abstract: A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

Abstract: A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

Abstract: A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

Abstract: Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, resulting in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: The present invention provides a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation during conventional profiling, is removed or pre-profiled to off-set the leading edge of the plated through hole from a surface of the circuit board.

Abstract: A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the electronic package is sealed.

Abstract: Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, resulting in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: An apparatus for fabricating holes in a thin film has an elongated holding block for holding a column of electromagnetic driving coils. The holding block acts as a single unit, and is magnetically attached to a punch diebar. The magnetic attraction between the holding block and diebar provides easy assembly and disassembly of the parts.

Abstract: The present invention provides a system for recording a heat exchange event within a drilled hole wall caused during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.

Abstract: The present invention provides a method of creating a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation using conventional profiling methods, is removed or pre-profiled. The pre-profiled plated through hole is then profiled at a distance slightly off-set from the pre-profiled edge to further prevent burr formation.

Abstract: A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. Each board is x-rayed to determine location coordinates information of the inner layers of multi layer circuit board panels. An optimization process determines optimal locations for drilling. The board is then drilled according to the optimized coordinates. By minimizing misregistration between the drilled holes and inner layers of the multi layer semiconductor circuit board, the present invention reduces a significant cause of scrap to the circuit board industry as well as removing a major impediment to further increasing circuit density and wireability.

Abstract: The present invention provides a system for recording a heat exchange event within a drilled hole wall of a substrate during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.

Abstract: The present invention provides a system for recording a heat exchange event within a drilled hole wall of a substrate during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.

Abstract: A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.

Abstract: A drill bit for forming holes in a printed circuit board. The drill bit includes a first end including a tip for contacting the material of the circuit board. A second end of the drill bit is attached to apparatus for rotating the drill bit. A cutting edge is in the vicinity of the first end. A pressure pad is opposite the cutting edge. A flute winds upwardly about the drill bit in a helix. An angle of the helix with respect to a longitudinal axis of the drill bit varies continuously, wherein the angle is about from about 15.degree. to about 35.degree. in the vicinity of the first end and increases with increasing distance from the first end to at least from about 35.degree. to about 65.degree..

Abstract: Disclosed is a method of producing vias and through holes through a metal laminate. The laminate is a multi-layer, for example, a trilayer of a relatively hard metal between two layers of a relatively soft metal. The method includes the steps of first etching a clearance hole through the soft metal on one side of the trilayer laminate, followed by partially etching the hard metal layer. Next, drilling the remaining thickness of the hard metal, and drilling through the second layer of soft metal.

Abstract: An optics and environmental protection device for laser processing applications in which a laser processing assembly including a laser beam source is used to process a substrate. The laser processing assembly includes an optical focusing assembly including at least one lens located between the laser source and the substrate for focusing the laser beam on the substrate. The optics and environmental protection device includes a housing defining a chamber located between the optical focusing assembly and the substrate. The housing includes a first opening located adjacent to the optical focusing assembly for admitting the laser beam into the chamber, a second opening located adjacent to the substrate which allows the beam to exit the chamber, a third opening adjacent to which a source of pressurized gas is located, and a fourth opening adjacent to which a vacuum source is located.

Abstract: Flexure means are provided for holding a tip member of an ultrasonically reciprocating element against lateral movement while freely permitting its longitudinal movement. The reciprocating element is held fixed at a nodal point distant from the tip member. The flexure means having a natural frequency substantially the same as the reciprocating element so as to resonate in concert therewith. In one embodiment, a flexible disc fixed around its periphery is centrally pierced to receive and engage the reciprocating element. In another embodiment, a plurality of elongated resonant supports are mounted at spaced radial positions on a fixture provided with a central opening through which the reciprocating element extends so that free ends of the resonant supports are directed at and engage the reciprocating element. In this embodiment, at least two of the resonant supports are adjustable toward and away from the longitudinal axis of the reciprocating element so as to properly position it.