Patents by Inventor David E. Leeson

David E. Leeson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4626775
    Abstract: Wafer probing apparatus especially adapted to probing surface acoustic wave (SAW) device die such as delay lines is disclosed; the apparatus includes a probe card especially suited to the radio frequency and multiple output nature of a SAW delay line together with a computer-aided electronic system for exciting the delay line and evaluating its output.
    Type: Grant
    Filed: May 4, 1984
    Date of Patent: December 2, 1986
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Frederick Y. Cho, Michael D. Adamo, David E. Leeson