Abstract: Method and apparatus to test continuity of miniature printed circuit board traces prior to installation of components. A short circuits probe and an open circuits probe are each provided which are specific to the pattern of traces to be tested. The probes are constructed by adapting a mirror image of the traces to be tested as probe contact points and registering the adapted mirror image as plating on a second circuit board substrate. Interconnections between contact points are typically provided on the back side of the second substrate. The interconnections couple the contact points with a continuity indicator. The circuit pattern specific probes according to the invention are employed by aligning the contact points with the circuit board traces to be tested and then effecting contact therebetween. The plating forming the contact points is of sufficient uniformity and elevation to provide desired clearance between adjacent traces.