Abstract: A conductive panel adapted to align and retain a printed circuit board modular device carrier assembly. The assembly includes a printed circuit board and a plurality of modular electronic device carriers, each sized to slidably receive a modular electronic device such as a Gigabit Interface Converter. The panel includes at least two generally rectangular openings oriented in a row of opening. The openings are sized to permit the modular electronic device to be slidably disposed therethrough. At least one inwardly extending conductive finger is provided integral with the panel and generally orthogonal to the inner panel surface adjacent the bottom edge of the opening and at least one inwardly extending finger is provided integral with the panel generally orthogonal to the inner panel surface adjacent the upper edge of the opening. The upper and lower fingers securely retain the printed circuit board carrier assembly therebetween when the carrier assembly and panel are in assembled relation.