Abstract: A testable circuit arrangement includes an integrated circuit (IC) package. The IC package includes a package substrate, an interposer mounted directly on the package substrate with level 1 interconnects, and at least one IC die mounted directly on the interposer with level 0 interconnects. The package substrate of the IC package is mounted directly on a connector board with a soldered ball grid array of level 2 interconnects. The level 0, level 1, and level 2 interconnects include respective power, configuration, and test interconnects. Power, configuration, and test terminals of the connector board are coupled to the power, configuration, and test interconnects of the level 2 interconnects.

Abstract: Method and system for a programmable device programmer. The disclosure describes various embodiments for programming a target programmable device by a programmer. In one embodiment, the programmer determines availability of updated configuration data for a hardware component of the programmer. The programmer includes the software component coupled to the hardware component. An update mode of the hardware component is enabled in response to availability of the updated configuration data, and programming of the target programmable device is disabled while the hardware component is in the update mode. A programmable device internal to the hardware component is programmed with the updated configuration data while the hardware component is in the update mode, and the update mode is disabled in response to completion of programming of the at least one programmable device. A target programmable device may then be programmed by the programmer having the updated configuration data.